SCHEMBL649034

SCHEMBL649034

Nc1ccc(Oc2ccc(-c3ccc(Oc4ccc(N)c(C(F)(F)F)c4)cc3)cc2)cc1C(F)(F)F

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NR4A1 P22736 1/20 0.47
AR P10275 5/20 0.44
KIF11 P52732 2/20 0.41
FFAR4 Q5NUL3 2/20 0.40
HDAC3 O15379 2/20 0.38
BRAF P15056 2/20 0.38
HDAC4 P56524 2/20 0.38
HDAC1 Q13547 2/20 0.38
HDAC7 Q8WUI4 2/20 0.38
HDAC2 Q92769 2/20 0.38
HDAC10 Q969S8 2/20 0.38
HDAC11 Q96DB2 2/20 0.38
HDAC8 Q9BY41 2/20 0.38
HDAC6 Q9UBN7 2/20 0.38
HDAC9 Q9UKV0 2/20 0.38
HDAC5 Q9UQL6 2/20 0.38
ALDH1A1 P00352 2/20 0.38
MEN1 O00255 1/20 0.38
MITF O75030 1/20 0.38
GAA P10253 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30287636 1.00 NR4A1 (0.47) NR4A1ARKIF11FFAR4HDAC3
SCHEMBL8146457 0.94 NR4A1 (0.52) NR4A1ARFFAR4HDAC3BRAF
SCHEMBL710315 0.92 NR4A1 (0.54) NR4A1ARFFAR4HDAC3BRAF
SCHEMBL7190049 0.89 ALDH1A1 (0.52) NR4A1ARKIF11FFAR4ALDH1A1
SCHEMBL29896686 0.89 ALDH1A1 (0.52) NR4A1ARKIF11FFAR4ALDH1A1
SCHEMBL10664109 0.87 MAOB (0.48) NR4A1ARFFAR4ALDH1A1MEN1
SCHEMBL30287666 0.87 MAOB (0.48) NR4A1ARFFAR4ALDH1A1MEN1
SCHEMBL21332700 0.87 SCN9A (0.47) NR4A1ARFFAR4HDAC3BRAF
SCHEMBL1241806 0.86 FFAR4 (0.55) NR4A1ARFFAR4HDAC3BRAF
SCHEMBL38659445 0.86 AR (0.60) NR4A1ARFFAR4HDAC3BRAF

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 326 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7459047-B2 Preparation of flexible copper foil/polyimide laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-02 US claimed
US-5601905-A Laminate for insulation protection of circuit boards NIPPON STEEL CHEMICAL CO., LTD. (JP) 1997-02-11 US claimed
US-5399655-A Acid-labile poly(amic acetal ester) E. I. DU PONT DE NEMOURS AND COMPANY (US) 1995-03-21 US claimed
US-20260147277-A1 TRANSFER FILM, PATTERN FORMING METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE FUJIFILM CORPORATION (JP) 2026-05-28 US disclosed
CN-122074126-A Photosensitive composition, transfer film, method for producing laminate, and semiconductor package 富士胶片株式会社 2026-05-22 CN disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
EP-3633455-B1 PHOTOSENSITIVE RESIN COMPOSITION, POLYMERIC PRECURSOR, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-04-08 EP disclosed
EP-3859447-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2025-11-19 EP disclosed
US-12473403-B2 Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor FUJIFILM CORPORATION (JP) 2025-11-18 US disclosed
US-12422750-B2 Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device FUJIFILM CORPORATION (JP) 2025-09-23 US disclosed
US-20250264801-A1 RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-21 US disclosed
EP-0297139-A1 FLEXIBLE PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION NIPPON STEEL CHEMICAL CO., LTD. (JP) 1989-01-04 EP disclosed
US-4792476-A AROMATIC POLYIMIDES HITACHI, LTD. (JP) 1988-12-20 US disclosed
US-4760126-A Fluorine-containing polyamide-acid derivative and polyimide HITACHI, LTD. (JP) 1988-07-26 US disclosed
US-4735492-A POLYIMIDE-ISOIDOLOQUINAZOLINEDIONE HITACHI CHEMICAL COMPANY, LTD. (JP) 1988-04-05 US disclosed
US-4690999-A MOLECULARLY-ORIENTED POLYIMIDES BASED ON PARA-AROMATIC DIAMINES; FILMS; PROTECTIVE COATINGS; INTEGRATED CIRCUITS HITACHI, LTD. (JP) 1987-09-01 US disclosed
EP-0219336-A2 Liquid crystal orientation controlling film and liquid crystal device using the same Hitachi Chemical Co., Ltd. (JP) 1987-04-22 EP disclosed
US-4641924-A Liquid crystal device HITACHI, LTD. (JP) 1987-02-10 US disclosed
EP-0142149-A2 Use of fluorine containing polyimides for aligning layers of liquid crystal display devices. HITACHI, LTD. (JP) 1985-05-22 EP disclosed
EP-0133533-A2 Low thermal expansion resin material for a wiring insulating film. HITACHI, LTD. (JP) 1985-02-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260147277-A1 TRANSFER FILM, PATTERN FORMING METHOD, LAMINATE, AND SEMICONDUCTOR PACKAGE LCP1, PCNA, FDFT1 NR4A1 3417/4885AR 4656/4885KIF11 3873/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.