Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GPR3 | P46089 | 2/20 | 0.38 |
| ▸ | CA1 | P00915 | 2/20 | 0.37 |
| ▸ | CA2 | P00918 | 2/20 | 0.37 |
| ▸ | CA7 | P43166 | 1/20 | 0.37 |
| ▸ | CA13 | Q8N1Q1 | 1/20 | 0.37 |
| ▸ | ACHE | P22303 | 8/20 | 0.34 |
| ▸ | KCNH2 | Q12809 | 6/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Trifluoromethanesulfonic Acid SCHEMBL7145436 | 0.90 | GPR3 (0.37) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL25301943 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL18788979 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL19915225 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL25287606 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL25292878 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL25255863 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL23430060 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 | |
| Trifluoromethanesulfonic Acid SCHEMBL20570425 | 0.82 | — | — | |
| Trifluoromethanesulfonic Acid SCHEMBL25285896 | 0.82 | CA1 (0.44) | GPR3CA1CA2CA7CA13 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1011 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116836389-B | Low-temperature-curable positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2024-01-26 | — | — | CN | claimed |
| EP-2469337-B1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | HITACHI CHEM DUPONT MICROSYS (JP) | 2014-01-22 | — | — | EP | claimed |
| EP-2469337-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic component | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2012-06-27 | — | — | EP | claimed |
| US-8053158-B2 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-11-08 | — | — | US | claimed |
| US-20070202436-A1 | Photosensitive compositions useful for forming active patterns, methods of forming such active patterns and organic memory devices incorporating such active patterns | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-30 | — | — | US | claimed |
| US-7026497-B2 | Adhesive compound and method for forming photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-04-11 | — | — | US | claimed |
| US-20050158651-A1 | Adhesive compound and method for forming photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2005-07-21 | — | — | US | claimed |
| JP-11071363-A | — | — | None | — | — | JP | disclosed |
| JP-8240907-A | — | — | None | — | — | JP | disclosed |
| US-20260146026-A1 | COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT | ADEKA CORPORATION (JP) | 2026-05-28 | — | — | US | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260093178-A1 | POLYMER, METHOD OF PRODUCING THE SAME, RESIST COMPOSITION INCLUDING THE POLYMER, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2026-04-02 | — | — | US | disclosed |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-03-24 | — | — | US | disclosed |
| EP-0875789-A1 | Resist composition and its use for forming pattern | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1998-11-04 | — | — | EP | disclosed |
| EP-0789279-A1 | Polymer and resist material | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1997-08-13 | — | — | EP | disclosed |
| EP-0780732-A2 | Polymer composition and resist material | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1997-06-25 | — | — | EP | disclosed |
| US-5558971-A | HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1996-09-24 | — | — | US | disclosed |
| US-5558976-A | HYDROXYSTYRENE POLYMER DERIVATIVES, PHOTOACID GENERATOR, PHOTORESISTS | WAKO PURE CHEMICAL INDUSTRIES, LTD. (JP) | 1996-09-24 | — | — | US | disclosed |
| JP-H08240907-A | RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | HITACHI LTD | 1996-09-17 | — | — | JP | disclosed |
| EP-0704762-A1 | Resist material and pattern formation | WAKO PURE CHEMICAL INDUSTRIES LTD (JP) | 1996-04-03 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | GPR3 942/4885CA1 332/4885CA2 242/4885 |
| US-20260146026-A1 | COMPOUND, COMPOSITION, CURED PRODUCT, METHOD FOR PRODUCING CURED PRODUCT, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT | CBR3, CBR1, NOTUM | GPR3 3108/4885CA1 467/4885CA2 1035/4885 |
| US-20260093178-A1 | POLYMER, METHOD OF PRODUCING THE SAME, RESIST COMPOSITION INCLUDING THE POLYMER, AND PATTERN FORMATION METHOD USING THE RESIST COMPOSITION | RPS21, CA11, RPL21 | GPR3 4005/4885CA1 27/4885CA2 285/4885 |
| US-12583973-B2 | Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component | PRDM9, ARCN1, PUF60 | GPR3 3596/4885CA1 1162/4885CA2 1038/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.