⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28742666 | 0.77 | — | — | |
| SCHEMBL3469258 | 0.77 | — | — | |
| SCHEMBL28267609 | 0.75 | — | — | |
| SCHEMBL28754485 | 0.73 | — | — | |
| SCHEMBL7753435 | 0.73 | — | — | |
| SCHEMBL28609599 | 0.73 | — | — | |
| SCHEMBL7907627 | 0.70 | — | — | |
| SCHEMBL2638270 | 0.69 | — | — | |
| SCHEMBL6029131 | 0.69 | — | — | |
| SCHEMBL27589611 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240174623-A1 | Build UP Film Curable Compositions | AGC Multi Material America, Inc. | 2024-05-30 | — | — | US | claimed |
| US-20240174802-A1 | Build UP Film Curable Compositions | AGC MULTI MAT AMERICA INC (US) | 2024-05-30 | — | — | US | claimed |
| US-9455064-B2 | Ceramic filled fluoropolymer compositions, methods and applications thereof | Centre for Materials for Electronics Technology (C-MET) (IN) | 2016-09-27 | — | — | US | claimed |
| US-20140162065-A1 | Ceramic Filled Fluoropolymer Compositions, Methods and Applications Thereof | Centre for Materials for Electronics Technology (C-MET) (IN) | 2014-06-12 | — | — | US | claimed |
| US-20050123739-A1 | Mesoporous silica/fluorinated polymer composite material | CHUNG YUAN CHRISTIAN UNIVERSITY (TW) | 2005-06-09 | — | — | US | claimed |
| US-RE36396-E | FLUOROPOLYMER, CERAMIC FILLER WITH SILANE COATING | ROGERS CORPORATION (US) | 1999-11-16 | — | — | US | claimed |
| US-5384181-A | Fluoropolymer with ceramic fillers and silane coatings | ROGERS CORPORATION (US) | 1995-01-24 | — | — | US | claimed |
| EP-0279769-B1 | Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material | ROGERS CORP (US) | 1994-09-21 | — | — | EP | claimed |
| US-5061548-A | Silane coating; hydrophobic, improved tensile and peel strength, dimensional stability | ROGERS CORPORATION (US) | 1991-10-29 | — | — | US | claimed |
| US-4849284-A | CERAMIC FILLED FLUOROPOLYMER | ROGERS CORPORATION (US) | 1989-07-18 | — | — | US | claimed |
| EP-0279769-A2 | Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material | ROGERS CORPORATION (US) | 1988-08-24 | — | — | EP | claimed |
| EP-4652118-A1 | AN ASSEMBLY FOR DISPENSING POLYMERIC FOAM AND RELATED DISPENSING METHODS | Soudal N.V. (BE) | 2025-11-26 | — | — | EP | disclosed |
| EP-4196532-B1 | SILICONE FORMULATION COMPRISING AN OXIME CROSSLINKER, CURED SILICONE FORMULATION AND USES THEREOF | SOUDAL N V (BE) | 2024-09-18 | — | — | EP | disclosed |
| WO-2024153772-A1 | AN ASSEMBLY FOR DISPENSING POLYMERIC FOAM AND RELATED DISPENSING METHODS | Soudal N.V. (BE) | 2024-07-25 | — | — | WO | disclosed |
| CN-118048003-A | High-purity inorganic powder/fluorine-containing polymer composite material and preparation method thereof | 深圳清华大学研究院 | 2024-05-17 | — | — | CN | disclosed |
| US-RE36396-E | FLUOROPOLYMER, CERAMIC FILLER WITH SILANE COATING | ROGERS CORPORATION (US) | 1999-11-16 | — | — | US | disclosed |
| EP-0279769-B1 | Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material | ROGERS CORP (US) | 1994-09-21 | — | — | EP | disclosed |
| US-5149590-A | Fluoropolymer filled with ceramic having a coating of fluorinated silane | ROGERS CORPORATION (US) | 1992-09-22 | — | — | US | disclosed |
| US-4849284-A | CERAMIC FILLED FLUOROPOLYMER | ROGERS CORPORATION (US) | 1989-07-18 | — | — | US | disclosed |
| EP-0279769-A2 | Electrical substrate material, multilayer circuit and integrated circuit chip carrier package comprising said material | ROGERS CORPORATION (US) | 1988-08-24 | — | — | EP | disclosed |