Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 1/20 | 0.38 |
| ▸ | CTDSP1 | Q9GZU7 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.32 |
| ▸ | GOT1 | P17174 | 1/20 | 0.31 |
| ▸ | CHRM1 | P11229 | 1/20 | 0.31 |
| ▸ | HRH1 | P35367 | 1/20 | 0.31 |
| ▸ | VNN1 | O95497 | 1/20 | 0.31 |
| ▸ | P2RX7 | Q99572 | 1/20 | 0.31 |
| ▸ | KCNK13 | Q9HB14 | 1/20 | 0.30 |
| ▸ | GLA | P06280 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3771338 | 0.77 | — | — | |
| SCHEMBL465245 | 0.74 | HRH1 (0.44) | TDP1ALDH1A1SMN1; SMN2HRH1 | |
| Hydrochloric Acid SCHEMBL28440523 | 0.73 | HRH1 (0.42) | TDP1ALDH1A1SMN1; SMN2HRH1 | |
| Phenol SCHEMBL27923007 | 0.71 | TDP1 (0.33) | TDP1GLA | |
| SCHEMBL9771883 | 0.71 | HTR1D (0.36) | CYP1A2CTDSP1 | |
| SCHEMBL1325916 | 0.70 | — | — | |
| SCHEMBL3079246 | 0.69 | CYP1A2 (0.47) | CYP1A2CTDSP1GOT1CHRM1HRH1 | |
| SCHEMBL3076036 | 0.69 | CYP1A2 (0.47) | CYP1A2CTDSP1ALDH1A1GOT1CHRM1 | |
| SCHEMBL9771179 | 0.69 | CYP3A4 (0.47) | CYP1A2CTDSP1ALDH1A1TP53CYP3A4 | |
| SCHEMBL9771712 | 0.69 | CTDSP1 (0.36) | CYP1A2CTDSP1P2RX7 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6946198-B2 | A semiconductor device is bonded to a wiring board, using a liquid binder containing epoxy resins and a hydrolyzed silantriol coupling agents, a curing agent, and conductive metallic powder; low viscosity | HITACHI, LTD. (JP) | 2005-09-20 | — | — | US | disclosed |
| US-6821657-B1 | PREHEATING A MIXTURE OF AN EPOXY RESIN, AND ORGANOSILICON COMPOUND AND WATER PRIOR TO ADDING A CURING AGENT IS EFFECTIVE TO OBTAIN A THERMOSETTING RESIN COMPOSITION WHICH HAS A LOW VISCOSITY AT A ROOM TEMPERATURE | HITACHI, LTD. (JP) | 2004-11-23 | — | — | US | disclosed |
| US-20040007769-A1 | Solvent-free thermosetting resin composition, process for producing the same, and product therefrom | TAKAHASHI AKIO (JP) | 2004-01-15 | — | — | US | disclosed |