SCHEMBL6538009

SCHEMBL6538009

Cc1c(N)c(C)c2c(c1N)C(C)(C)CC2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9770642 0.85 LIMK1 (0.30)
SCHEMBL6537754 0.85 LIMK1 (0.30)
SCHEMBL6538183 0.83
SCHEMBL6538088 0.80
SCHEMBL6538170 0.72 LIMK1 (0.31)
SCHEMBL9770711 0.71 CD44 (0.33)
SCHEMBL6537903 0.67 LIMK1 (0.33)
SCHEMBL6538085 0.67
SCHEMBL6538263 0.67
SCHEMBL5155072 0.65 LIMK1 (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4987261-A Diaminoindane derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1991-01-22 US claimed
JP-5170859-A None JP disclosed
JP-1050848-A None JP disclosed
CN-113994257-B Photosensitive polyimide resin composition 合肥汉之和新材料科技有限公司 2024-12-24 CN disclosed
EP-3529294-B1 EPOXY RESIN COMPOSITIONS AND FIBER-REINFORCED COMPOSITE MATERIALS PREPARED THEREFROM TORAY INDUSTRIES (JP) 2022-05-18 EP disclosed
CN-113994257-A Photosensitive polyimide resin composition 合肥汉之和新材料科技有限公司 2022-01-28 CN disclosed
CN-109890866-B Epoxy resin composition and fiber-reinforced composite material prepared therefrom 东丽株式会社 2021-11-12 CN disclosed
WO-2020246565-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION 株式会社ピーアイ技術研究所 2020-12-10 WO disclosed
US-10829633-B2 Epoxy resin compositions and fiber-reinforced composite materials prepared therefrom TORAY INDUSTRIES, INC. (JP) 2020-11-10 US disclosed
CN-107949594-B Epoxy resin composition and fiber-reinforced composite material produced therefrom 东丽株式会社 2020-03-24 CN disclosed
EP-0478216-B1 Resin compositions MITSUI TOATSU CHEMICALS (JP) 1996-03-20 EP disclosed
US-5367095-A Polyamine compounds containing secondary amino substituents and compositions containing such compounds NIPPON PAINT COMPANY, LTD. (JP) 1994-11-22 US disclosed
US-5334670-A Internal release agent which is polyester condensate of fatty acid having hydroxy group MITSUI TOATSU CHEMICALS, INC. (JP) 1994-08-02 US disclosed
US-5306788-A Release agents; polyesterurethane copolymer MITSUI TOATSU CHEMICALS, INC. (JP) 1994-04-26 US disclosed
JP-H05170859-A ELASTOMER AND ITS MANUFACTURE MITSUI TOATSU CHEM INC 1993-07-09 JP disclosed
US-5198508-A Release agent for reaction injection molding MITSUI TOATSU CHEMICALS, INC. (JP) 1993-03-30 US disclosed
EP-0513964-A2 (Polyurethane) Elastomer and process for producing it (with a specific releasing agent) MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-11-19 EP disclosed
EP-0499206-A2 Polyamine compositions containing secondary amine functions NIPPON PAINT CO., LTD. (JP) 1992-08-19 EP disclosed
EP-0478216-A1 Resin compositions MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-04-01 EP disclosed
US-4987261-A Diaminoindane derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1991-01-22 US disclosed