SCHEMBL5155072

SCHEMBL5155072

CC1(C)CCc2c(N)ccc(N)c21

nearest known ligand 0.34

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
LIMK1 P53667 1/20 0.34
CD44 P16070 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29724586 1.00 LIMK1 (0.34) LIMK1CD44
SCHEMBL9507986 0.77 ALDH1A1 (0.38) CD44
SCHEMBL6538170 0.75 LIMK1 (0.31) LIMK1
SCHEMBL9770711 0.74 CD44 (0.33) LIMK1CD44
SCHEMBL6538512 0.72
SCHEMBL6537985 0.72
SCHEMBL6538565 0.71
SCHEMBL9770642 0.71 LIMK1 (0.30) LIMK1
SCHEMBL25692553 0.71 THRB (0.38)
SCHEMBL25693570 0.71 LMNA (0.38) LIMK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11899364-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2024-02-13 US claimed
US-11782344-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2023-10-10 US claimed
EP-3286605-B1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MAT USA INC (US) 2023-06-28 EP claimed
EP-3286606-B1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MAT USA INC (US) 2022-12-28 EP claimed
CN-108027563-B Photosensitive polyimide composition 富士胶片电子材料美国有限公司 2021-12-03 CN claimed
US-20200218152-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2020-07-09 US claimed
US-20190171105-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2019-06-06 US claimed
US-10036952-B2 Photosensitive polyimide compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-07-31 US claimed
US-20160313641-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 US claimed
US-20160313642-A1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2016-10-27 US claimed
US-4987261-A Diaminoindane derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1991-01-22 US claimed
US-20250188223-A1 POLYIMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME FUJIFILM ELECTRONIC MAT USA INC (US) 2025-06-12 US disclosed
US-20250189892-A1 POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME FUJIFILM ELECTRONIC MAT USA INC (US) 2025-06-12 US disclosed
US-20250188311-A1 POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME FUJIFILM ELECTRONIC MAT USA INC (US) 2025-06-12 US disclosed
US-20250188312-A1 POLY-O-HYDROXYAMIDES COMPRISING NOVEL INDANE BIS-O-AMINOPHENOLS, PHOTOSENSITIVE COMPOSITIONS, DIELECTRIC FILMS, AND BUFFER COATINGS CONTAINING THE SAME FUJIFILM ELECTRONIC MAT USA INC (US) 2025-06-12 US disclosed
US-20020182536-A1 Polyimides and polyamic acids MITSUI CHEMICALS, INC. (JP) 2002-12-05 US disclosed
EP-1225192-A1 POLYIMIDES AND POLYAMIC ACIDS Mitsui Chemicals, Inc. (JP) 2002-07-24 EP disclosed
US-5367095-A Polyamine compounds containing secondary amino substituents and compositions containing such compounds NIPPON PAINT COMPANY, LTD. (JP) 1994-11-22 US disclosed
EP-0499206-A2 Polyamine compositions containing secondary amine functions NIPPON PAINT CO., LTD. (JP) 1992-08-19 EP disclosed
US-4987261-A Diaminoindane derivatives MITSUI TOATSU CHEMICALS, INC. (JP) 1991-01-22 US disclosed