Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ODC1 | P11926 | 1/20 | 0.41 |
| ▸ | NPC1 | O15118 | 1/20 | 0.33 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.32 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.31 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.30 |
| ▸ | CA12 | O43570 | 2/20 | 0.30 |
| ▸ | CA1 | P00915 | 2/20 | 0.30 |
| ▸ | CA2 | P00918 | 2/20 | 0.30 |
| ▸ | CA3 | P07451 | 2/20 | 0.30 |
| ▸ | CA4 | P22748 | 2/20 | 0.30 |
| ▸ | CA6 | P23280 | 2/20 | 0.30 |
| ▸ | CA5A | P35218 | 2/20 | 0.30 |
| ▸ | CA7 | P43166 | 2/20 | 0.30 |
| ▸ | CA9 | Q16790 | 2/20 | 0.30 |
| ▸ | CA14 | Q9ULX7 | 2/20 | 0.30 |
| ▸ | CA5B | Q9Y2D0 | 2/20 | 0.30 |
| ▸ | DNM1 | Q05193 | 1/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
| ▸ | BLM | P54132 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26288724 | 0.90 | — | — | |
| SCHEMBL29291655 | 0.90 | NPC1 (0.45) | ODC1NPC1SIGMAR1CA1CA2 | |
| SCHEMBL6318844 | 0.87 | NPC1 (0.48) | ODC1NPC1SIGMAR1CA1CA2 | |
| SCHEMBL15108551 | 0.87 | NPC1 (0.48) | ODC1NPC1SIGMAR1CA1CA2 | |
| SCHEMBL5737986 | 0.83 | MEN1 (0.40) | ODC1LMNATSHR | |
| SCHEMBL12461901 | 0.83 | ODC1 (0.30) | ODC1 | |
| SCHEMBL13162816 | 0.82 | — | — | |
| SCHEMBL11780411 | 0.82 | NPC1 (0.36) | NPC1 | |
| SCHEMBL20288192 | 0.82 | NPC1 (0.32) | NPC1 | |
| SCHEMBL8060908 | 0.80 | NPC1 (0.47) | NPC1NFKB1SIGMAR1SPHK1CA12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9181464-B2 | Adhesive resin compositions, and laminates and flexible printed wiring boards using same | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2015-11-10 | — | — | US | disclosed |
| US-20120048598-A1 | ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (JP) | 2012-03-01 | — | — | US | disclosed |
| US-20120043118-A1 | ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (JP) | 2012-02-23 | — | — | US | disclosed |
| US-20110305883-A1 | ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (JP) | 2011-12-15 | — | — | US | disclosed |
| US-20110303439-A1 | ADHESIVE RESIN COMPOSITIONS, AND LAMINATES AND FLEXIBLE PRINTED WIRING BOARDS USING SAME | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC, (JP) | 2011-12-15 | — | — | US | disclosed |
| US-6951665-B2 | Radio-conductive material, method of manufacturing the same, solid sensor using the same, method of manufacturing radio-conductive film, and radiation image read-out apparatus | FUJI PHOTO FILM CO., LTD. (JP) | 2005-10-04 | — | — | US | disclosed |
| US-20050170074-A1 | RADIO-CONDUCTIVE MATERIAL, METHOD OF MANUFACTURING THE SAME, SOLID SENSOR USING THE SAME, METHOD OF MANUFACTURING RADIO-CONDUCTIVE FILM, AND RADIATION IMAGE READ-OUT APPARATUS | FUJI PHOTO FILM CO., LTD. | 2005-08-04 | — | — | US | disclosed |
| US-6717173-B2 | Radio-conductive material, method of manufacturing the same, solid sensor using the same, method of manufacturing radio-conductive film, and radiation image read-out apparatus | FUJI PHOTO FILM CO., LTD. (JP) | 2004-04-06 | — | — | US | disclosed |
| US-20010015416-A1 | Radio-conductive material, method of manufacturing the same, solid sensor using the same, method of manufacturing radio-conductive film, and radiation image read-out apparatus | FUJIFILM CORPORATION (JP) | 2001-08-23 | — | — | US | disclosed |
| US-4528304-A | Polyamide resin composition | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 1985-07-09 | — | — | US | disclosed |