⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL323121 | 0.74 | — | — | |
| SCHEMBL109814 | 0.65 | — | — | |
| SCHEMBL3716058 | 0.65 | — | — | |
| SCHEMBL35782 | 0.63 | — | — | |
| SCHEMBL7736019 | 0.63 | ALDH1A1 (0.33) | — | |
| SCHEMBL11343451 | 0.61 | — | — | |
| SCHEMBL28131554 | 0.60 | — | — | |
| SCHEMBL3401765 | 0.59 | — | — | |
| SCHEMBL8849980 | 0.59 | — | — | |
| SCHEMBL2025258 | 0.59 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 138 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118580628-A | Resin composition, preparation method, adhesive sheet and copper-clad plate | 无锡乐晟睿科技有限公司 | 2024-09-03 | — | — | CN | claimed |
| WO-2024130760-A1 | FLUORINE-CONTAINING RESIN-BASED COMPOSITE MATERIAL AND USE THEREOF | 广东生益科技股份有限公司 | 2024-06-27 | — | — | WO | claimed |
| CN-118240315-A | Fluorine-containing resin-based dielectric layer and preparation method and application thereof | 广东生益科技股份有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-117777626-A | Fluorine-containing resin composition, fluorine-containing resin-based dielectric layer and application of fluorine-containing resin composition and fluorine-containing resin-based dielectric layer | 广东生益科技股份有限公司 | 2024-03-29 | — | — | CN | claimed |
| CN-117777627-A | Resin composition, copper-clad plate and application thereof | 广东生益科技股份有限公司 | 2024-03-29 | — | — | CN | claimed |
| CN-115975316-B | Fluorine-containing resin matrix composite and application thereof | 广东生益科技股份有限公司 | 2024-03-08 | — | — | CN | claimed |
| US-20230303292-A1 | CAP LINER COMPRISING A SINTERED FLUOROPOLYMER LAYER | ROGERS CORPORATION | 2023-09-28 | — | — | US | claimed |
| CN-115975316-A | Fluorine-containing resin matrix composite material and application thereof | 广东生益科技股份有限公司 | 2023-04-18 | — | — | CN | claimed |
| CN-115315351-A | Flexible dielectric material comprising biaxially oriented polytetrafluoroethylene reinforcement layer | 罗杰斯公司 | 2022-11-08 | — | — | CN | claimed |
| EP-3702146-B1 | CAP LINER COMPRISING A SINTERED FLUOROPOLYMER LAYER | ROGERS CORP (US) | 2022-02-23 | — | — | EP | claimed |
| CN-111316382-A | Polyimide composition having low coefficient of thermal expansion | 罗杰斯公司 | 2020-06-19 | — | — | CN | claimed |
| EP-1105930-B1 | LASER CUTTING AND JOINING A FLUORINATED POLYMER MEMBRANE TO A POLYMER FRAME | REGENESYS TECH LTD (GB) | 2003-03-12 | — | — | EP | claimed |
| US-20260116049-A1 | POLYMER FILM, LAMINATE, AND PRODUCTION METHOD OF LAMINATE | FUJIFILM CORPORATION (JP) | 2026-04-30 | — | — | US | disclosed |
| US-20260116048-A1 | POLYMER FILM AND LAMINATE | FUJIFILM CORPORATION (JP) | 2026-04-30 | — | — | US | disclosed |
| US-12570076-B2 | Film and laminate | FUJIFILM CORPORATION (JP) | 2026-03-10 | — | — | US | disclosed |
| US-12532414-B2 | Liquid crystal polymer film, polymer film, and laminate | FUJIFILM CORPORATION (JP) | 2026-01-20 | — | — | US | disclosed |
| CN-112806103-A | Printed circuit board substrate comprising coated boron nitride | 罗杰斯公司 | 2021-05-14 | — | — | CN | disclosed |
| CN-111316382-A | Polyimide composition having low coefficient of thermal expansion | 罗杰斯公司 | 2020-06-19 | — | — | CN | disclosed |
| CN-110168670-A | Dielectric layer with improved thermal conductivity | 罗杰斯公司 | 2019-08-23 | — | — | CN | disclosed |
| WO-2004051782-A1 | FUEL CELL INCORPORATING A POLYMER ELECTROLYTE MEMBRANE GRAFTED BY IRRADIATION | DUBITSKY YURI A (IT) | 2004-06-17 | — | — | WO | disclosed |