SCHEMBL6545109

SCHEMBL6545109

COC1(O)c2ccccc2C=CC1O

nearest known ligand 0.35

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 2/20 0.35
PKM P14618 1/20 0.35
PDK2 Q15119 11/20 0.33
ALDH1A1 P00352 1/20 0.32
MAPT P10636 1/20 0.32
ITGA4 P13612 1/20 0.32
KIF11 P52732 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11034491 0.84 KDM4E (0.36) KDM4EPKMPDK2ALDH1A1MAPT
SCHEMBL6545025 0.78 KDM4E (0.37) KDM4EPKMPDK2KIF11
SCHEMBL6544863 0.77 KDM4E (0.35) KDM4EPKMPDK2
SCHEMBL31286204 0.77 KDM4E (0.35) KDM4EPKMPDK2
SCHEMBL15716844 0.76 PDK2 (0.34) KDM4EPKMPDK2
SCHEMBL6545414 0.74 KDM4E (0.33) KDM4EPKMPDK2
SCHEMBL7525101 0.74 KDM4E (0.33) KDM4EPKMPDK2
SCHEMBL20036246 0.72 CACNB4 (0.34) KDM4EPKM
SCHEMBL7567336 0.70 THRB (0.39) KDM4EPKMALDH1A1KIF11
SCHEMBL11772294 0.69 KDM4E (0.33) KDM4EALDH1A1MAPTITGA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5597876-A CURING AGENT PROVIDES BETTER MECHANICAL PROPERTIES AT HIGH TEMPERATURE SHELL OIL COMPANY (US) 1997-01-28 US claimed
EP-1218178-B1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA TEK INC (US) 2004-01-07 EP disclosed
EP-1218178-A4 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA TEK INC (US) 2003-01-08 EP disclosed
EP-1218178-A1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS Ga-Tek Inc. (US) 2002-07-03 EP disclosed
WO-2001019607-A1 AN ADHESION PROMOTING LAYER FOR USE WITH EPOXY PREPREGS GA-TEK INC. (US) 2001-03-22 WO disclosed
US-6117536-A MULTILAYER STRUCTURE COMPRISING PREPREG LAYER MADE FROM EPOXY RESIN AND NON-AMINE CURING AGENT, NITROGEN-CONTAINING SILANE ADHESION PROMOTING LAYER GA-TEK INC. (US) 2000-09-12 US disclosed
EP-0720630-B1 EPOXY RESIN COMPOSITION SHELL INT RESEARCH (NL) 1999-03-17 EP disclosed
US-5597876-A CURING AGENT PROVIDES BETTER MECHANICAL PROPERTIES AT HIGH TEMPERATURE SHELL OIL COMPANY (US) 1997-01-28 US disclosed
EP-0720630-A1 EPOXY RESIN COMPOSITION SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) 1996-07-10 EP disclosed
EP-0682052-A1 Composition of epoxy resins based on condensed polynuclear aromatic compounds SHELL INTERNATIONALE RESEARCHMAATSCHAPPIJ B.V. (NL) 1995-11-15 EP disclosed
WO-1995008584-A1 EPOXY RESIN COMPOSITION SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V. (NL) 1995-03-30 WO disclosed