SCHEMBL6545555

SCHEMBL6545555

CCOC(O)COCCOCCOCCOCCO

nearest known ligand 0.46

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.46
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
THRB P10828 1/20 0.42
HTT P42858 1/20 0.42
MAPT P10636 1/20 0.42
TSHR P16473 2/20 0.42
MAPK1 P28482 1/20 0.42
HSD17B10 Q99714 1/20 0.35
TDP1 Q9NUW8 1/20 0.34
USP2 O75604 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28646292 1.00 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBHTT
SCHEMBL28653923 1.00 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBHTT
SCHEMBL560277 1.00 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBHTT
SCHEMBL27206797 1.00 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBHTT
SCHEMBL11430944 1.00 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBHTT
SCHEMBL1575863 1.00 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBHTT
SCHEMBL28643735 1.00 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATHRBHTT
SCHEMBL98646 0.96 ALDH1A1 (0.50) ALDH1A1MEN1KMT2ATHRBHTT
Boric Acid SCHEMBL28422355 0.94 ALDH1A1 (0.41) ALDH1A1MEN1KMT2ATHRBHTT
Diethylene Glycol Monoethyl Ether SCHEMBL1076753 0.92 ALDH1A1 (0.54) ALDH1A1MEN1KMT2ATHRBHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12331228-B2 Photocurable resin composition, cured product, and laminated body THREEBOND CO., LTD. (JP) 2025-06-17 US claimed
US-11560475-B2 Photocurable resin composition, cured product, and laminate THREEBOND CO., LTD. (JP) 2023-01-24 US claimed
EP-4714983-A1 PHOTOCURABLE RESIN COMPOSITION AND CURED OBJECT FORMED THEREFROM ThreeBond Co., Ltd. (JP) 2026-03-25 EP disclosed
US-20250329859-A1 APPLICATION SYSTEM AESC JAPAN LTD (JP) 2025-10-23 US disclosed
EP-4635636-A1 APPLICATION SYSTEM AESC Japan Ltd. (JP) 2025-10-22 EP disclosed
US-12331228-B2 Photocurable resin composition, cured product, and laminated body THREEBOND CO., LTD. (JP) 2025-06-17 US disclosed
WO-2025052775-A1 PHOTOCURABLE RESIN COMPOSITION 株式会社スリーボンド 2025-03-13 WO disclosed
WO-2024237158-A1 PHOTOCURABLE RESIN COMPOSITION AND CURED OBJECT FORMED THEREFROM 株式会社スリーボンド 2024-11-21 WO disclosed
US-20240270934-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THREEBOND CO., LTD. (JP) 2024-08-15 US disclosed
CN-113621338-B Photocurable resin composition, cured product, and laminate 三键有限公司 2024-07-19 CN disclosed
EP-4353761-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT ThreeBond Co., Ltd. (JP) 2024-04-17 EP disclosed
EP-3907246-B1 PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE THREE BOND CO LTD (JP) 2023-10-18 EP disclosed
US-11560475-B2 Photocurable resin composition, cured product, and laminate THREEBOND CO., LTD. (JP) 2023-01-24 US disclosed
WO-2022259786-A1 THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT 株式会社スリーボンド 2022-12-15 WO disclosed
US-20220145150-A1 PHOTOCURABLE RESIN COMPOSITION, CURED PRODUCT, AND LAMINATED BODY THREEBOND CO., LTD. (JP) 2022-05-12 US disclosed
CN-114456327-A Photocurable resin composition, cured product, and laminate 三键有限公司 2022-05-10 CN disclosed
CN-113621338-A Photocurable resin composition, cured product, and laminate 三键有限公司 2021-11-09 CN disclosed
US-20040014898-A1 Water-absorptive contact lens and method of producing the same MENICON CO., LTD. (JP) 2004-01-22 US disclosed
EP-1378769-A2 Water-absorptive contact lens and method of producing the same Menicon Co., Ltd. (JP) 2004-01-07 EP disclosed
US-4194066-A POLYMERIZING POLYOXYALKYLENE GLYCOL (METH)ACRYLATES JAPAN ATOMIC ENERGY RESEARCH INSTITUTE (JP) 1980-03-18 US disclosed