SCHEMBL6545804

SCHEMBL6545804

Oc1nc(O)nc(OCC2CO2)n1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.42
ALDH1A1 P00352 7/20 0.41
TSHR P16473 5/20 0.41
TP53 P04637 4/20 0.41
HIF1A Q16665 2/20 0.41
CYP3A4 P08684 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
GLA P06280 1/20 0.39
MAPT P10636 2/20 0.37
HPGD P15428 2/20 0.37
MEN1 O00255 2/20 0.37
KMT2A Q03164 2/20 0.37
PKM P14618 2/20 0.37
CYP1A2 P05177 1/20 0.37
PPARG P37231 1/20 0.37
LMNA P02545 1/20 0.37
GAA P10253 1/20 0.37
MAPK1 P28482 1/20 0.32
FGFR1 P11362 1/20 0.31
SRC P12931 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16880542 1.00 TDP1 (0.42) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL3677603 0.96 TDP1 (0.42) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL15668603 0.91 TDP1 (0.37) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL29398866 0.87 TDP1 (0.48) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL487480 0.87 TDP1 (0.48) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL29397562 0.87 TDP1 (0.48) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL11207182 0.83 ALDH1A1 (0.47) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL28406986 0.81 TDP1 (0.42) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL28485348 0.80 TSHR (0.50) TDP1ALDH1A1TSHRTP53HIF1A
SCHEMBL48796 0.78 TDP1 (0.41) TDP1ALDH1A1TSHRTP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021135375-A1 GRAPHENE AB ADHESIVE AND PREPARATION METHOD THEREFOR 苏州桐力光电股份有限公司 2021-07-08 WO claimed
US-4369207-A PHOTOPOLYMERIZING TEIJIN LIMITED (JP) 1983-01-18 US claimed
US-4292151-A MELT SPINNING THE BLOCK POLYMER WITH AN UNSATURATED COMPOUND; CURING WITH ACTINIC RADIATION TEIJIN LIMITED (JP) 1981-09-29 US claimed
EP-4051724-A1 IMPREGNATION RESIN FOR A WOVEN OR STITCHED FABRIC Sika Technology AG (CH) 2022-09-07 EP disclosed
WO-2021135375-A1 GRAPHENE AB ADHESIVE AND PREPARATION METHOD THEREFOR 苏州桐力光电股份有限公司 2021-07-08 WO disclosed
WO-2021083744-A1 IMPREGNATION RESIN FOR A WOVEN OR STITCHED FABRIC SIKA TECHNOLOGY AG (CH) 2021-05-06 WO disclosed
WO-2021058574-A1 HARDENER FOR EPOXY CASTING RESINS SIKA TECHNOLOGY AG (CH) 2021-04-01 WO disclosed
US-9893287-B2 Nano-encapsulating polymers with high barrier properties EMPIRE TECHNOLOGY DEVELOPMENT LLC (US) 2018-02-13 US disclosed
US-20150333261-A1 NANO-ENCAPSULATING POLYMERS WITH HIGH BARRIER PROPERTIES CRESTLINE DIRECT FINANCE, L.P. 2015-11-19 US disclosed
WO-2014092826-A1 NANO-ENCAPSULATING POLYMERS WITH HIGH BARRIER PROPERTIES EMPIRE TECHNOLOGY DEVELOPMENT LLC (US) 2014-06-19 WO disclosed
WO-2013086004-A1 PRESSURE SENSITIVE ADHESIVES BASED ON CARBOXYLIC ACIDS AND EPOXIDES STATE OF OREGON ACTING BY AND THROUGH THE STATE BOARD OF HIGHER EDUCATION ON BEHALF OF OREGON STATE UNIVERSITY (US) 2013-06-13 WO disclosed
EP-1123354-B1 HIGH-TEMPERATURE RESISTANT POLYMERIZABLE METAL OXIDE PARTICLES INST OBERFLAECHENMODIFIZIERUNG (DE) 2004-01-07 EP disclosed
EP-1123354-A1 HIGH-TEMPERATURE RESISTANT POLYMERIZABLE METAL OXIDE PARTICLES Institut für Oberflächenmodifizierung e.V. (DE) 2001-08-16 EP disclosed
WO-2000022052-A1 HIGH-TEMPERATURE RESISTANT POLYMERIZABLE METAL OXIDE PARTICLES Institut für Oberflächenmodifizierung e.V. (DE) 2000-04-20 WO disclosed