⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10032080 | 0.77 | — | — | |
| SCHEMBL12032236 | 0.74 | PIK3CD (0.32) | — | |
| SCHEMBL18632692 | 0.74 | — | — | |
| SCHEMBL3542486 | 0.73 | CYP2D6 (0.39) | — | |
| SCHEMBL16217677 | 0.72 | — | — | |
| SCHEMBL16217682 | 0.72 | — | — | |
| SCHEMBL7092807 | 0.70 | — | — | |
| SCHEMBL15770 | 0.69 | — | — | |
| SCHEMBL5703992 | 0.69 | PTGS1 (0.37) | — | |
| SCHEMBL15980922 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6777817-B2 | SEMICONDUCTOR BONDED TO CHIP CARRIER OR HEAT SPREADER WITH REWORKABLE ADHESIVE COMPRISING CURED REACTION PRODUCT FROM DIEPOXIDE AND CYCLIC ANHYDRIDE; AND FILLER | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-08-17 | — | — | US | claimed |
| US-20040041280-A1 | Bonding semiconductor to chip carrier; reaction product of epoxide, anhydride and acyclic acetal compound | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-03-04 | — | — | US | claimed |
| WO-2023210311-A1 | ACTINIC RAY CURABLE INK COMPOSITION AND PRINTED MATTER | 東洋インキＳＣホールディングス株式会社 | 2023-11-02 | — | — | WO | disclosed |
| US-20230148278-A1 | DOUBLE-LAYER SEAMLESS CAPSULE CONTAINING WATER-SOLUBLE COMPOSITION | FUJI CAPSULE CO., LTD (JP) | 2023-05-11 | — | — | US | disclosed |
| EP-4129414-A1 | DOUBLE-LAYER SEAMLESS CAPSULE CONTAINING WATER-SOLUBLE COMPOSITION | Fuji Capsule Co., Ltd. (JP) | 2023-02-08 | — | — | EP | disclosed |
| CN-115135407-A | Two-layer seamless capsule with water-soluble composition as inner coating | 富士胶囊股份有限公司 | 2022-09-30 | — | — | CN | disclosed |
| EP-1231233-B1 | Curing composition | KANSAI PAINT CO LTD (JP) | 2004-01-14 | — | — | EP | disclosed |
| US-20020151626-A1 | Curing composition | KANSAI PAINT CO., LTD. (JP) | 2002-10-17 | — | — | US | disclosed |
| EP-1231233-A1 | Curing composition | KANSAI PAINT CO., LTD. (JP) | 2002-08-14 | — | — | EP | disclosed |
| US-6166100-A | Cationically polymerizable pigmented composition | KANSAI PAINT CO., LTD. (JP) | 2000-12-26 | — | — | US | disclosed |