SCHEMBL15770

SCHEMBL15770

C1CC2OC2CC1CC1CCC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15980922 1.00
SCHEMBL16217683 0.95
SCHEMBL15707736 0.91
Bicarbonate SCHEMBL2015874 0.89 TFPI2 (0.43)
SCHEMBL1904180 0.89 CHRM5 (0.32)
Formic Acid SCHEMBL2248024 0.87 TFPI2 (0.32)
SCHEMBL15681668 0.87
SCHEMBL3548485 0.87 PTGS1 (0.33)
SCHEMBL4454482 0.85
SCHEMBL16217678 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2219 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2868692-B2 Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication STRATASYS INC (US) 2025-07-16 EP claimed
EP-4545600-A1 CATIONIC PHOTOCURABLE COMPOSITION, PAINT, ARTICLE OF MANUFACTURE WITH PHOTOCURABLE COATING, AND INK Changzhou Zhengjie Intelligent Manufacture Technology Co., Ltd. (CN) 2025-04-30 EP claimed
US-12269933-B2 Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication STRATASYS, INC. (US) 2025-04-08 US claimed
EP-4491679-A2 STABILIZED MATRIX-FILLED LIQUID RADIATION CURABLE RESIN COMPOSITIONS FOR ADDITIVE FABRICATION Stratasys, Inc. (US) 2025-01-15 EP claimed
EP-3971235-B1 STABILIZED MATRIX-FILLED LIQUID RADIATION CURABLE RESIN COMPOSITIONS FOR ADDITIVE FABRICATION STRATASYS INC (US) 2025-01-01 EP claimed
CN-119220105-A Photocurable resin composition and application thereof 常州强力电子新材料股份有限公司 2024-12-31 CN claimed
CN-117659668-B Low-temperature heat-curable resin composition, anisotropic conductive film, and connection structure 常州德创高新材料科技有限公司 2024-12-06 CN claimed
US-12071566-B2 Antimony-free radiation curable compositions for additive fabrication, and applications thereof in investment casting processes STRATASYS INC. (US) 2024-08-27 US claimed
EP-4410906-A2 IMPROVED ANTIMONY-FREE RADIATION CURABLE COMPOSITIONS FOR ADDITIVE FABRICATION, AND APPLICATIONS THEREOF IN INVESTMENT CASTING PROCESSES Stratasys, Inc. (US) 2024-08-07 EP claimed
CN-118053610-A Thermally curable conductive composition, film and method for preparing same 聚镕光电(广州)新材料科技有限公司 2024-05-17 CN claimed
EP-0618246-A2 Aqueous silylated epoxy resin dispersion OSi Specialties, Inc. (US) 1994-10-05 EP claimed
WO-1993025386-A1 THERMALLY RESISTANT GLASS ARTICLE ENSIGN-BICKFORD COATINGS COMPANY (US) 1993-12-23 WO claimed
EP-0343101-B1 ACIDIC ADHESION PROMOTERS FOR PVC PLASTISOLS W.R. Grace & Co.-Conn. (US) 1992-07-15 EP claimed
US-5024922-A High temperature baking prior to development; retention of photosensitivity, high resolution, dielectric properties BREWER SCIENCE, INC., ROLLA, MO A CORP. OF MO 1991-06-18 US claimed
WO-1990005382-A1 POSITIVE WORKING POLYAMIC ACID/IMIDE PHOTORESIST COMPOSITIONS AND THEIR USE AS DIELECTRICS BREWER SCIENCE, INC. (US) 1990-05-17 WO claimed
EP-0321824-A2 Liquid irradiation-curable resin used for insulating thin conductors SIEMENS AKTIENGESELLSCHAFT (DE) 1989-06-28 EP claimed
EP-0132685-B1 METHOD FOR THE PREPARATION OF AN EPOXY RESIN MOULDING COMPOSITION SIEMENS AKTIENGESELLSCHAFT (DE) 1987-03-18 EP claimed
EP-0198498-A2 Blends of polycaprolactone polyols and polyepoxides UNION CARBIDE CORPORATION (US) 1986-10-22 EP claimed
EP-0182066-A1 Sealing compound for electrical or electronic construction parts or groups SIEMENS AKTIENGESELLSCHAFT (DE) 1986-05-28 EP claimed
EP-0103204-A1 Composition and process for blanketing the sumps of storage cavities Ruhrgas Aktiengesellschaft (DE) 1984-03-21 EP claimed