Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | CDK1 | P06493 | 2/20 | 0.37 |
| ▸ | CCNB1 | P14635 | 2/20 | 0.37 |
| ▸ | CCNE1 | P24864 | 2/20 | 0.37 |
| ▸ | CDK2 | P24941 | 2/20 | 0.37 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.34 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.34 |
| ▸ | RAB9A | P51151 | 2/20 | 0.33 |
| ▸ | TLR8 | Q9NR97 | 5/20 | 0.32 |
| ▸ | NOS3 | P29474 | 2/20 | 0.32 |
| ▸ | NOS2 | P35228 | 2/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | ADORA3 | P0DMS8 | 1/20 | 0.31 |
| ▸ | ADORA2A | P29274 | 1/20 | 0.31 |
| ▸ | ADORA2B | P29275 | 1/20 | 0.31 |
| ▸ | ADORA1 | P30542 | 1/20 | 0.31 |
| ▸ | RECQL | P46063 | 1/20 | 0.30 |
| ▸ | NOS1 | P29475 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10779248 | 0.73 | SPNS2 (0.56) | TSHRTLR8 | |
| SCHEMBL28308341 | 0.69 | TLR8 (0.53) | ALDH1A1KDM4EL3MBTL1RAB9ATLR8 | |
| Methylamine SCHEMBL27516532 | 0.69 | ALDH1A1 (0.48) | ALDH1A1CDK1CCNB1CCNE1CDK2 | |
| SCHEMBL15676781 | 0.68 | TLR8 (0.43) | RAB9ATLR8NPC1 | |
| SCHEMBL9007771 | 0.68 | TSHR (0.49) | ALDH1A1CDK1CCNB1CCNE1CDK2 | |
| SCHEMBL4334641 | 0.68 | — | — | |
| SCHEMBL28327462 | 0.66 | ALDH1A1 (0.50) | ALDH1A1NOS3NOS2 | |
| SCHEMBL28223263 | 0.65 | — | — | |
| SCHEMBL19627040 | 0.64 | NPC1 (0.44) | ALDH1A1KDM4ERAB9AMAPTNPC1 | |
| SCHEMBL10223523 | 0.63 | ALDH1A1 (0.47) | ALDH1A1KDM4EMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 164 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114685935-B | Low dielectric constant resin composition and preparation method and application thereof | 衡所华威电子有限公司 | 2024-02-27 | — | — | CN | claimed |
| CN-115298260-A | Resin composition, prepreg, molded article, and method for producing prepreg | 三菱化学株式会社 | 2022-11-04 | — | — | CN | claimed |
| CN-114685935-A | Low-dielectric-constant resin composition and preparation method and application thereof | 衡所华威电子有限公司 | 2022-07-01 | — | — | CN | claimed |
| CN-109320914-B | Molding material, sheet molding material, block molding material, and fiber-reinforced composite material | 三菱化学株式会社 | 2021-09-21 | — | — | CN | claimed |
| CN-107743502-B | Curing composition | 爱客多有限公司 | 2020-08-28 | — | — | CN | claimed |
| CN-111748078-B | Curable resin composition for pore-filling | 太阳控股株式会社 | 2024-05-17 | — | — | CN | disclosed |
| CN-117903395-A | Polyurethane modified epoxy resin and application thereof | 日铁化学材料株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-116096528-B | Soldering flux and soldering paste | 千住金属工业株式会社 | 2024-04-09 | — | — | CN | disclosed |
| CN-114058304-B | Aminated imide composition | PPG工业俄亥俄公司 | 2024-04-05 | — | — | CN | disclosed |
| CN-117795002-A | Epoxy resin composition, liquid compression molding material, top encapsulation material, and semiconductor device | 纳美仕有限公司 | 2024-03-29 | — | — | CN | disclosed |
| CN-117616093-A | Thermosetting adhesive sheet | 日东电工株式会社 | 2024-02-27 | — | — | CN | disclosed |
| CN-117461127-A | Liquid compression molding material, electronic component, semiconductor device, and method for manufacturing semiconductor device | 纳美仕有限公司 | 2024-01-26 | — | — | CN | disclosed |
| CN-110622258-A | Conductive material and connection structure | 积水化学工业株式会社 | 2019-12-27 | — | — | CN | disclosed |
| CN-110603294-A | Molding material composition for sealing SiC and GaN elements, and electronic component device | 京瓷株式会社 | 2019-12-20 | — | — | CN | disclosed |
| CN-110582840-A | Semiconductor device and method for manufacturing the same | 日立化成株式会社 | 2019-12-17 | — | — | CN | disclosed |
| CN-104910844-B | Conductive adhesive composition, connector, solar cell module, and method for producing same | 日立化成株式会社 | 2019-12-13 | — | — | CN | disclosed |
| CN-110556344-A | Adhesive for semiconductor, method for manufacturing semiconductor device, and semiconductor device | HITACHI CHEMICAL CO LTD | 2019-12-10 | — | — | CN | disclosed |
| CN-110544665-A | Back adhesive film and dicing tape-integrated back adhesive film | NITTO DENKO CORP | 2019-12-06 | — | — | CN | disclosed |
| EP-1387873-A1 | SEALANT COMPOSITION, SEALANT AND LAMINATED STRUCTURE CONTAINING SAME | 3M Innovative Properties Company (US) | 2004-02-11 | — | — | EP | disclosed |
| WO-2002090455-A1 | SEALANT COMPOSITION, SEALANT AND LAMINATED STRUCTURE CONTAINING SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2002-11-14 | — | — | WO | disclosed |