SCHEMBL6561484

SCHEMBL6561484

C=C[Si](C=C)(CC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15301592 0.81
SCHEMBL4077277 0.79
SCHEMBL3481415 0.79
SCHEMBL1263470 0.79
SCHEMBL4084495 0.79
SCHEMBL12898566 0.77
SCHEMBL10014691 0.77
SCHEMBL15301928 0.75 TSHR (0.38)
SCHEMBL3482441 0.75 TSHR (0.33)
SCHEMBL6562627 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US claimed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US claimed
US-20250389016-A1 GAS BARRIER FILM MATERIAL, SILICON OXIDE FILM, AND PRODUCTION METHOD OF SILICON OXIDE FILM TOSOH CORP (JP) 2025-12-25 US disclosed
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US disclosed
US-12252790-B2 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2025-03-18 US disclosed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US disclosed
WO-2024014503-A1 GAS BARRIER FILM MATERIAL, SILICON OXIDE FILM, AND PRODUCTION METHOD OF SILICON OXIDE FILM 東ソー株式会社 2024-01-18 WO disclosed
WO-2022255290-A1 METHOD FOR MANUFACTURING PLANARIZING FILM, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-12-08 WO disclosed
WO-2022230944-A1 PLANARIZING FILM MANUFACTURING METHOD, PLANARIZING FILM MATERIAL, AND PLANARIZING FILM 東ソー株式会社 2022-11-03 WO disclosed
US-9969850-B2 Method for producing modified polymer, and rubber composition TOYO TIRE & RUBBER CO., LTD. (JP) 2018-05-15 US disclosed
US-20160009875-A1 METHOD FOR PRODUCING MODIFIED POLYMER, AND RUBBER COMPOSITION TOYO TIRE & RUBBER CO., LTD. (JP) 2016-01-14 US disclosed
US-8791221-B2 Addition-curable metallosiloxane compound DAICEL CORPORATION (JP) 2014-07-29 US disclosed
EP-2650319-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND Daicel Corporation (JP) 2013-10-16 EP disclosed
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND DAICEL CORPORATION (JP) 2013-10-10 US disclosed
CN-103249762-A Addition-curable metallosiloxane compound DAICEL CORP 2013-08-14 CN disclosed
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed