SCHEMBL6562627

SCHEMBL6562627

C=C[Si](C=C)(CC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10014691 0.79
SCHEMBL3482062 0.78
SCHEMBL1262043 0.74
SCHEMBL4082803 0.74
SCHEMBL8421919 0.74
SCHEMBL6561484 0.74
SCHEMBL4086344 0.74
SCHEMBL3482556 0.74 TSHR (0.35)
SCHEMBL13621384 0.72
SCHEMBL13621371 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US claimed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US claimed
US-20250188615-A1 Gapfill Methods and Processing Assemblies ASM IP HOLDING B.V. (NL) 2025-06-12 US disclosed
US-12252790-B2 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2025-03-18 US disclosed
CN-118843711-A Material for gas barrier film, silicon oxide film, and method for producing silicon oxide film 东曹株式会社 2024-10-25 CN disclosed
US-20240117494-A1 Gapfill methods and processing assemblies ASM IP HOLDING B.V. (NL) 2024-04-11 US disclosed
CN-117355632-A Method for producing planarizing film, material for planarizing film, and planarizing film 东曹株式会社 2024-01-05 CN disclosed
US-9969850-B2 Method for producing modified polymer, and rubber composition TOYO TIRE & RUBBER CO., LTD. (JP) 2018-05-15 US disclosed
EP-3245256-A1 ORGANOPOLYSILOXANE PREPOLYMER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING SAME Henkel AG & Co. KGaA (DE) 2017-11-22 EP disclosed
CN-105189565-B Process for producing modified polymer and rubber composition 东洋橡胶工业株式会社 2017-03-15 CN disclosed
WO-2016112487-A1 ORGANOPOLYSILOXANE PREPOLYMER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING SAME HENKEL (CHINA) COMPANY LIMITED (CN) 2016-07-21 WO disclosed
CN-105189565-A Process for producing modified polymer and rubber composition TOYO TIRE & RUBBER CO 2015-12-23 CN disclosed
US-8791221-B2 Addition-curable metallosiloxane compound DAICEL CORPORATION (JP) 2014-07-29 US disclosed
EP-2650319-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND Daicel Corporation (JP) 2013-10-16 EP disclosed
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND DAICEL CORPORATION (JP) 2013-10-10 US disclosed
CN-103249762-A Addition-curable metallosiloxane compound DAICEL CORP 2013-08-14 CN disclosed
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed