SCHEMBL6562747

SCHEMBL6562747

C=CC(C=C)(O[SiH3])c1ccccc1

nearest known ligand 0.34

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 1/20 0.34
TSHR P16473 4/20 0.34
ALDH1A1 P00352 4/20 0.34
KCNN4 O15554 3/20 0.33
HTT P42858 1/20 0.32
ALOX15 P16050 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2449393 0.82 TSHR (0.39) MAPK1TSHRALDH1A1KCNN4HTT
SCHEMBL60172 0.81 MAPK1 (0.37) MAPK1TSHRALDH1A1KCNN4HTT
SCHEMBL15194199 0.81 MAPK1 (0.42) MAPK1TSHRALDH1A1KCNN4HTT
Naphthalene SCHEMBL9797900 0.76 CYP2A6 (0.35) MAPK1TSHRALDH1A1KCNN4HTT
SCHEMBL9786528 0.76 TSHR (0.35) MAPK1TSHRALDH1A1KCNN4HTT
SCHEMBL296247 0.74 MAPK1 (0.41) MAPK1TSHRALDH1A1KCNN4ALOX15
Phenol SCHEMBL9786531 0.72 CA12 (0.44) MAPK1TSHRALDH1A1KCNN4HTT
SCHEMBL17886485 0.72 ALDH1A1 (0.39) MAPK1TSHRALDH1A1HTTALOX15
Hydroquinone SCHEMBL9798456 0.72 ESR2 (0.45) TSHRALDH1A1HTTALOX15
Phenol SCHEMBL9743604 0.72 CA12 (0.44) MAPK1TSHRALDH1A1KCNN4HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3375808-B1 PARTICLES, PARTICLE MATERIAL, CONNECTING MATERIAL, AND CONNECTION STRUCTURE SEKISUI CHEMICAL CO LTD (JP) 2022-12-21 EP disclosed
CN-115181223-A Low-gloss matte auxiliary agent, preparation method thereof and formed body 铨盛聚碳科技股份有限公司 2022-10-14 CN disclosed
CN-114085382-A Hydrogen-containing poly titanium boron siloxane flame retardant, and preparation method and application thereof 铨盛聚碳科技股份有限公司 2022-02-25 CN disclosed
CN-114068067-A Metal-containing particle, connecting material, connecting structure and method for producing same, conduction test member, and conduction test device 积水化学工业株式会社 2022-02-18 CN disclosed
CN-107709414-B Particle, particle material, connecting material, and connecting structure 积水化学工业株式会社 2021-12-28 CN disclosed
CN-111095441-B Metal-containing particle, connecting material, connecting structure, method for producing connecting structure, member for conduction test, and conduction test device 积水化学工业株式会社 2021-11-23 CN disclosed
CN-108140450-B Metal-containing particle, connecting material, connection structure, and method for producing connection structure 积水化学工业株式会社 2021-08-03 CN disclosed
US-20200269315-A1 METAL-CONTAINING PARTICLE, CONNECTION MATERIAL, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, CONDUCTION INSPECTION MEMBER, AND CONDUCTION INSPECTION DEVICE SEKISUI CHEMICAL CO., LTD. (JP) 2020-08-27 US disclosed
EP-3686903-A1 METAL-CONTAINING PARTICLE, CONNECTION MATERIAL, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, CONDUCTION INSPECTION MEMBER, AND CONDUCTION INSPECTION DEVICE Sekisui Chemical Co., Ltd. (JP) 2020-07-29 EP disclosed
CN-111095441-A Metal-containing particle, connecting material, connecting structure, method for producing connecting structure, member for conduction test, and conduction test device 积水化学工业株式会社 2020-05-01 CN disclosed
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND DAICEL CORPORATION (JP) 2013-10-10 US disclosed
WO-2013100166-A1 METHOD OF PRODUCING AN ORGANIC SILICON COMPOUND DOW CORNING TORAY CO., LTD. (JP) 2013-07-04 WO disclosed
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed
US-5439746-A Formed by coating or impregnating a reinforcement sheet and curing; mechanical strength; corrosion and heat resistance; electrical properties KABUSHIKI KAISHA TOSHIBA (JP) 1995-08-08 US disclosed
EP-0139234-B1 RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1989-11-29 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20130267653-A1 ADDITION-CURABLE METALLOSILOXANE COMPOUND B2M, MSI2, MNS1 MAPK1 2750/4885TSHR 4702/4885ALDH1A1 2073/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.