SCHEMBL6562800

SCHEMBL6562800

C=C[Si](C=C)(C=C)OCCOC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11053764 0.80
SCHEMBL113417 0.79
SCHEMBL49499 0.79
SCHEMBL600936 0.77
SCHEMBL29811192 0.77
SCHEMBL2479946 0.77
SCHEMBL5437398 0.77
SCHEMBL3482094 0.76 TSHR (0.30)
SCHEMBL11419817 0.75
SCHEMBL19356602 0.75 ALDH1A1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3429980-B1 SURFACE APPLIED CORROSION INHIBITOR SIKA TECH AG (CH) 2026-05-13 EP disclosed
CN-109071366-B Surface applied corrosion inhibitor 建筑研究和技术有限公司 2022-05-10 CN disclosed
US-20210214564-A1 SURFACE APPLIED CORROSION INHIBITOR SIKA TECHNOLOGY AG (CH) 2021-07-15 US disclosed
US-11001716-B2 Surface applied corrosion inhibitor CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2021-05-11 US disclosed
US-20190092948-A1 SURFACE APPLIED CORROSION INHIBITOR SIKA TECHNOLOGY AG (CH) 2019-03-28 US disclosed
EP-3429980-A1 SURFACE APPLIED CORROSION INHIBITOR Construction Research & Technology GmbH (DE) 2019-01-23 EP disclosed
CN-109071366-A SURFACE APPLIED CORROSION INHIBITOR 建筑研究和技术有限公司 2018-12-21 CN disclosed
WO-2017157836-A1 SURFACE APPLIED CORROSION INHIBITOR CONSTRUCTION RESEARCH & TECHNOLOGY GMBH (DE) 2017-09-21 WO disclosed
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
EP-0802067-B1 DIRECT DRAWING TYPE WATERLESS PLANOGRAPHIC ORIGINAL FORM PLATE TORAY INDUSTRIES (JP) 2002-04-24 EP disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed
US-6096476-A DIRECTLY IMAGEABLE RAW PLATE HAVING A HEAT INSULATING LAYER, HEAT SENSITIVE LAYER COMPRISING A LIGHT TO HEAT CONVERTING MATERIAL AND INK REPLELLENT LAYER IN THIS ORDER ON SUBSTRATE; PLATE HAS SPECIFIED ELASTIC MODULUS AND TENSILE PROPERTIES TORAY INDUSTRIES, INC. (JP) 2000-08-01 US disclosed
EP-0802067-A1 DIRECT DRAWING TYPE WATERLESS PLANOGRAPHIC ORIGINAL FORM PLATE TORAY INDUSTRIES, INC. (JP) 1997-10-22 EP disclosed