SCHEMBL6563197

SCHEMBL6563197

Nc1nc(N)nc(N)n1.O=P(O)(O)C(N(C(P(=O)(O)O)P(=O)(O)O)C(P(=O)(O)O)P(=O)(O)O)P(=O)(O)O

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
FDPS P14324 3/20 0.34
CYP1A2 P05177 1/20 0.32
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL61410 0.79 FDPS (0.48) FDPS
Phosphoric Acid SCHEMBL73239 0.76 CYP1A2 (0.42) CYP1A2LMNA
Phosphoric Acid SCHEMBL10873614 0.76 CYP1A2 (0.42) CYP1A2LMNA
Ammonia Solution, Strong SCHEMBL10538038 0.76 FDPS (0.46) FDPS
Phosphoric Acid SCHEMBL752823 0.76 CYP1A2 (0.42) CYP1A2LMNA
Ammonia Solution, Strong SCHEMBL7596444 0.76 FDPS (0.46) FDPS
Phosphoric Acid SCHEMBL670321 0.76 CYP1A2 (0.42) CYP1A2LMNA
Phosphoric Acid SCHEMBL407305 0.76 CYP1A2 (0.42) CYP1A2LMNA
Ammonia Solution, Strong SCHEMBL10863732 0.76 FDPS (0.46) FDPS
Phosphoric Acid SCHEMBL4801853 0.76 CYP1A2 (0.42) CYP1A2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6753476-B1 Flame-retardant adhesives and circuit materials with the use of the same SONY CHEMICALS CORPORATION (JP) 2004-06-22 US disclosed
EP-1095975-B1 Flame-retardant adhesives and circuit materials with the use of the same SONY CHEMICALS CORP (JP) 2004-03-24 EP disclosed
EP-0661342-B1 Additive for thermoplastic resins and flame retardant resin composition KANEGAFUCHI CHEMICAL IND (JP) 2003-04-02 EP disclosed
EP-1095975-A2 Flame-retardant adhesives and circuit materials with the use of the same Sony Chemicals Corporation (JP) 2001-05-02 EP disclosed
JP-2001098273-A FLAME RETARDANT COMPOSITION AND FLAME-RETARDANT RESIN COMPOSITION NIPPON CHEM IND CO LTD 2001-04-10 JP disclosed
US-5684071-A HETEROCYCLIC NITROGEN COMPOUND TREATED WITH FUNCTIONAL COMPOUND, IMPROVED COMPATIBILITY, MOLDING MATERIALS KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1997-11-04 US disclosed
EP-0661342-A1 Additive for thermoplastic resins and flame retardant resin composition KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1995-07-05 EP disclosed