SCHEMBL6564413

SCHEMBL6564413

CO[Si](C#Cc1ccccc1)(OC)O[Si](C#Cc1ccccc1)(OC)OC

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.44
GRM5 P41594 8/20 0.40
NPC1 O15118 4/20 0.40
RAB9A P51151 4/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
CYP1A2 P05177 2/20 0.40
CYP3A4 P08684 2/20 0.40
CYP2C9 P11712 2/20 0.40
CYP2C19 P33261 2/20 0.40
THPO P40225 2/20 0.40
KDM4E B2RXH2 1/20 0.40
ALDH1A1 P00352 1/20 0.40
TP53 P04637 1/20 0.40
CYP2D6 P10635 1/20 0.40
PKM P14618 1/20 0.40
HPGD P15428 1/20 0.40
ALOX15 P16050 1/20 0.40
GRIN2B Q13224 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6562897 0.91 APP (0.48) APPGRM5NPC1RAB9ASMN1; SMN2
SCHEMBL1639959 0.80 APP (0.37) APPGRM5CYP1A2KCNH2
SCHEMBL6564378 0.79 APP (0.39) APPGRM5NPC1RAB9ASMN1; SMN2
SCHEMBL6562555 0.78 APP (0.48) APPGRM5NPC1RAB9ASMN1; SMN2
SCHEMBL6563101 0.78 APP (0.48) APPGRM5NPC1RAB9ASMN1; SMN2
SCHEMBL6564285 0.78 APP (0.42) APPGRM5NPC1RAB9ASMN1; SMN2
SCHEMBL3953430 0.77 GRM5 (0.41) GRM5
SCHEMBL6564353 0.77 APP (0.46) APPGRM5NPC1RAB9ASMN1; SMN2
SCHEMBL6564060 0.77 APP (0.46) APPGRM5NPC1RAB9ASMN1; SMN2
SCHEMBL6562755 0.76 NPSR1 (0.40) APPGRM5NPC1RAB9ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed