SCHEMBL6564764

SCHEMBL6564764

CCO[Si](C)(C#Cc1ccccc1)O[Si](C)(C#Cc1ccccc1)OCC

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.38
NPC1 O15118 4/20 0.36
RAB9A P51151 4/20 0.36
GRM5 P41594 4/20 0.36
SMN1; SMN2 Q16637 3/20 0.36
CYP1A2 P05177 2/20 0.36
CYP3A4 P08684 2/20 0.36
CYP2C9 P11712 2/20 0.36
CYP2C19 P33261 2/20 0.36
THPO P40225 2/20 0.36
KDM4E B2RXH2 2/20 0.36
ALDH1A1 P00352 2/20 0.36
TP53 P04637 2/20 0.36
HPGD P15428 2/20 0.36
NPSR1 Q6W5P4 1/20 0.36
MEN1 O00255 1/20 0.36
CYP2D6 P10635 1/20 0.36
PKM P14618 1/20 0.36
ALOX15 P16050 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6564363 0.94 APP (0.42) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL1638774 0.85 NQO1 (0.33)
SCHEMBL6561443 0.81 APP (0.41) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL27910165 0.81 APP (0.41) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL6562877 0.81 APP (0.44) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL6564378 0.80 APP (0.39) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL6562820 0.79 APP (0.42) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL6561451 0.79 APP (0.42) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL6564285 0.79 APP (0.42) APPNPC1RAB9AGRM5SMN1; SMN2
SCHEMBL1638771 0.77 KDM4E (0.32) CYP1A2CYP3A4CYP2C9CYP2C19KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1122746-B1 Composition for film formation and insulating film JSR CORP (JP) 2004-09-22 EP disclosed
US-6468589-B2 A HEAT-CURED POLYETHER BASED ON A 9,9-BIS(P-HYDROXYPHENYL)-FLUORENE HAVING AT LEAST ONE ALKYL SUBSTITUENT AND A DIHYDROXY AROMATIC COMONOMER; LOW DIELECTRIC PROTECTIVE COATINGS; HEAT RESISTANCE; NONCRACKING JSR CORPORATION (JP) 2002-10-22 US disclosed
US-20010012870-A1 Composition for film formation and insulating film JSR CORPORATION (JP) 2001-08-09 US disclosed
EP-1122746-A1 Composition for film formation and insulating film JSR Corporation (JP) 2001-08-08 EP disclosed