SCHEMBL6567667

SCHEMBL6567667

O=C(O)c1ccc(Oc2ccc(C3(c4ccc(Oc5ccc(C(=O)O)c(C(=O)O)c5)c(-c5ccccc5)c4)c4ccccc4-c4ccccc43)cc2-c2ccccc2)cc1C(=O)O

nearest known ligand 0.43

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.43
PYGM P11217 11/20 0.41
PYGL P06737 10/20 0.41
GALK1 P51570 1/20 0.40
CASP6 P55212 1/20 0.40
MCL1 Q07820 1/20 0.40
PLEC Q15149 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
KDM4E B2RXH2 1/20 0.40
ESR1 P03372 1/20 0.36
ESR2 Q92731 1/20 0.36
HPSE Q9Y251 1/20 0.36
ALDH1A1 P00352 1/20 0.36
NCOA1 Q15788 1/20 0.35
NCOA3 Q9Y6Q9 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16209977 0.86 ESR1 (0.48) POLBPYGMPYGLTDP1KDM4E
SCHEMBL4891781 0.86 TTR (0.44) ESR1ESR2NCOA1NCOA3
SCHEMBL16210319 0.85 POLB (0.42) POLBPYGMPYGLTDP1KDM4E
SCHEMBL5669122 0.84 HTT (0.43) POLBTDP1KDM4EESR1ESR2
SCHEMBL29512285 0.84 POLB (0.57) POLBPYGMPYGLGALK1CASP6
SCHEMBL2035345 0.84 POLB (0.57) POLBPYGMPYGLGALK1CASP6
SCHEMBL5668269 0.84 AKR1C3 (0.49) TDP1KDM4E
SCHEMBL30821523 0.83 POLB (0.41) POLBPYGMPYGLTDP1KDM4E
SCHEMBL16211181 0.83 POLB (0.41) POLBPYGMPYGLTDP1KDM4E
SCHEMBL16210182 0.82 POLB (0.42) POLBPYGMPYGLKDM4EESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-11116675-A None JP disclosed
CN-118226707-A Photosensitive resin composition, cured film pattern, and method for producing same 奇美实业股份有限公司 2024-06-21 CN disclosed
CN-118210196-A Photosensitive resin composition, cured film pattern and method for producing the same 奇美实业股份有限公司 2024-06-18 CN disclosed
CN-118210199-A Photosensitive resin composition, cured film pattern, and method for producing same 奇美实业股份有限公司 2024-06-18 CN disclosed
CN-118210200-A Photosensitive resin composition, cured film pattern, and method for producing same 奇美实业股份有限公司 2024-06-18 CN disclosed
US-20240043619-A1 POLYIMIDE PRECURSOR RESIN COMPOSITION ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-02-08 US disclosed
CN-117289549-A Photosensitive resin composition, cured film pattern, and method for producing same 奇美实业股份有限公司 2023-12-26 CN disclosed
US-20140329941-A1 LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND LIQUID CRYSTAL DISPLAY ELEMENT HAVING THEREOF CHI MEI CORPORATION (TW) 2014-11-06 US disclosed
EP-0875906-B1 Electronic part and process for manufacturing the same JSR CORP (JP) 2004-04-07 EP disclosed
US-6084053-A AS STRUCTURAL COMPONENT, A DIELECTRIC POLYIMIDE MATERIAL HAVING AT LEAST ONE FLUORENE-CONTAINING STRUCTURAL UNIT; APPLYING POLYIMIDE SOLUTION TO SUBSTRATE, AND DRYING TO FORM THE DIELECTRIC; HEAT RESISTANCE, LOW DIELECTRIC CONSTANT JSR CORPORATION (JP) 2000-07-04 US disclosed
EP-0875906-A2 Electronic part and process for manufacturing the same JSR Corporation (JP) 1998-11-04 EP disclosed