SCHEMBL6568476

SCHEMBL6568476

O=C(CO)CCCCCCO

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 1/20 0.60
FFAR1 O14842 1/20 0.60
FFAR4 Q5NUL3 1/20 0.60
KDM4E B2RXH2 2/20 0.48
SMN1; SMN2 Q16637 1/20 0.48
FNTA P49354 1/20 0.44
FNTB P49356 1/20 0.44
CAMK2A Q9UQM7 1/20 0.43
LMNA P02545 4/20 0.40
GAA P10253 2/20 0.40
TSHR P16473 2/20 0.40
NFKB1 P19838 1/20 0.40
PMP22 Q01453 1/20 0.40
KMT2A Q03164 2/20 0.39
MAPT P10636 1/20 0.39
ALDH1A1 P00352 1/20 0.38
HSD17B10 Q99714 1/20 0.38
MEN1 O00255 1/20 0.38
HDAC3 O15379 1/20 0.35
HDAC1 Q13547 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3252869 1.00 GPR84 (0.60) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL5175947 1.00 GPR84 (0.60) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL10665941 1.00 GPR84 (0.60) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL29106439 1.00 GPR84 (0.60) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL3126483 0.97
SCHEMBL25212694 0.90 GPR84 (0.63) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL25428960 0.90 GPR84 (0.63) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL25432514 0.90 GPR84 (0.63) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL19066840 0.90 GPR84 (0.63) GPR84FFAR1FFAR4KDM4ESMN1; SMN2
SCHEMBL2435216 0.90 GPR84 (0.63) GPR84FFAR1FFAR4KDM4ESMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20200190351-A1 IMPROVED AQUEOUS PIGMENT DISPERSIONS LANDA CORPORATION LTD. (IL) 2020-06-18 US disclosed
US-20040261931-A1 Integrating the adhesive resin layer with the first substrate film layer,heating the surface of the adhesive resin layer by heat rays in the presence of oxygen to induce functional groups which contribute to adhesion, superimposing the second substrate film layer on adhesive resin layer with pressure NISSEI CHEMICAL CO., LTD. (JP) 2004-12-30 US disclosed
EP-1475425-A1 Thermal process for the manufacture of a laminate and apparatus therefor Nakamoto Packs Co., Ltd. (JP) 2004-11-10 EP disclosed