SCHEMBL6574611

SCHEMBL6574611

CCCC(=O)CC(=O)[O-].CCCO[Al+]OCCC

nearest known ligand 0.41

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HDAC3 O15379 3/20 0.41
HDAC1 Q13547 3/20 0.41
HDAC2 Q92769 3/20 0.41
HDAC8 Q9BY41 3/20 0.41
FFAR3 O14843 2/20 0.41
CES2 O00748 1/20 0.34
CES1 P23141 1/20 0.34
CA1 P00915 1/20 0.33
CA4 P22748 2/20 0.32
HAO1 Q9UJM8 1/20 0.32
ALDH1A1 P00352 1/20 0.31
HDAC6 Q9UBN7 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17106067 0.89 CA1 (0.44) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL542929 0.89 CA1 (0.39) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL17106140 0.88 HAO1 (0.47) CES2CES1CA1HAO1
SCHEMBL17106112 0.87 FFAR3 (0.33) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL1080160 0.87 HDAC3 (0.43) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL17105965 0.86 HAO1 (0.50) CES2CES1HAO1
SCHEMBL22685702 0.81 HDAC3 (0.44) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL1077918 0.81 HDAC3 (0.44) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL29036681 0.80 HDAC3 (0.52) HDAC3HDAC1HDAC2HDAC8FFAR3
SCHEMBL21219174 0.80 HDAC3 (0.57) HDAC3HDAC1HDAC2HDAC8FFAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773287-B2 Method for forming coating TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-03 US disclosed
US-20200369914-A1 METHOD FOR FORMING COATING TOKYO OHKA KOGYO CO., LTD. (JP) 2020-11-26 US disclosed
US-10421864-B2 Metal surface processing agent NOK CORPORATION (JP) 2019-09-24 US disclosed
US-10421865-B2 Rubber-metal adhesive NOK CORPORATION (JP) 2019-09-24 US disclosed
EP-2930257-B1 METAL SURFACE PROCESSING AGENT NOK CORP (JP) 2017-09-27 EP disclosed
US-20170037254-A1 RUBBER-METAL ADHESIVE NOK CORPORATION (JP) 2017-02-09 US disclosed
EP-2930257-A1 METAL SURFACE PROCESSING AGENT NOK Corporation (JP) 2015-10-14 EP disclosed
US-20150274989-A1 Metal Surface Processing Agent NOK CORPORATION (JP) 2015-10-01 US disclosed
EP-1090960-B1 TWO-PACK TYPE CURABLE COMPOSITION AND HARDENER THEREFOR KANEKA CORP (JP) 2004-06-02 EP disclosed
US-6703442-B1 CURING AGENT COMPOSITION FOR TWO-PACK TYPE CURABLE COMPOSITION USE, WHICH COMPRISES HYDROLYZABLE SILYL GROUP-CONTAINING COMPOUND INCLUDING AMINOALKYL GROUP, NON-PHTHALIC ACID ESTER BASED PLASTICIZER, AND BIVALENT TIN BASED CURING CATALYST KANEKA CORPORATION (JP) 2004-03-09 US disclosed
EP-1090960-A1 TWO-PACK TYPE CURABLE COMPOSITION AND HARDENER THEREFOR Kaneka Corporation (JP) 2001-04-11 EP disclosed