SCHEMBL6580529

SCHEMBL6580529

CCCCCCCCCCCCCCCCCCCCCCSC#N

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 5/20 0.42
THRB P10828 2/20 0.42
ALDH3A1 P30838 1/20 0.37
HSD17B10 Q99714 4/20 0.37
TP53 P04637 2/20 0.37
CES2 O00748 1/20 0.37
CTSL P07711 1/20 0.37
CTSB P07858 1/20 0.37
GMNN O75496 1/20 0.37
POLB P06746 1/20 0.37
MAPT P10636 1/20 0.37
CYP2C9 P11712 1/20 0.37
BLM P54132 1/20 0.37
ALDH1A1 P00352 3/20 0.36
HPGD P15428 1/20 0.36
MAPK1 P28482 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
HIF1A Q16665 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
NAAA Q02083 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4935480 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL3507116 1.00
SCHEMBL7188040 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL3409351 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL9451397 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL7133112 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL6241827 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL4284127 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL1873873 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53
SCHEMBL4958752 1.00 TSHR (0.42) TSHRTHRBALDH3A1HSD17B10TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1120435-B1 APPARATUS AND METHOD FOR PRODUCING RESIN TEIJIN LTD (JP) 2004-05-06 EP disclosed
US-6562936-B1 Resin excellent in hydrolysis and heat stability such as a reduction in molecular weight at the time of molding and color retention and moldability such as releasability and transferability, rarely experiences residence deterioration TEIJIN LIMITED (JP) 2003-05-13 US disclosed
US-6509435-B1 Heat resistance, stability; moldings TEIJIN LIMITED (JP) 2003-01-21 US disclosed
EP-1191049-A1 POLYCARBONATE, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2002-03-27 EP disclosed
EP-1120435-A1 APPARATUS AND METHOD FOR PRODUCING RESIN TEIJIN LIMITED (JP) 2001-08-01 EP disclosed