⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL264761 | 1.00 | — | — | |
| SCHEMBL2691269 | 1.00 | — | — | |
| SCHEMBL431619 | 0.98 | — | — | |
| SCHEMBL3389175 | 0.84 | — | — | |
| SCHEMBL8373207 | 0.84 | — | — | |
| SCHEMBL2212534 | 0.84 | — | — | |
| SCHEMBL2210924 | 0.84 | — | — | |
| SCHEMBL449924 | 0.84 | — | — | |
| SCHEMBL2212022 | 0.82 | — | — | |
| SCHEMBL983402 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 162 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122061234-A | CeO in-situ preparation method for copper-clad steel electrode surface2Method for preparing corrosion-resistant super-hydrophobic coating | 四川蜀能电科能源技术有限公司 | 2026-05-19 | — | — | CN | claimed |
| US-12565567-B2 | Multifunctional smart particles | SYNMATTER LLC (US) | 2026-03-03 | — | — | US | claimed |
| US-20240239968-A1 | Multifunctional Smart Particles | SYNMATTER LLC (US) | 2024-07-18 | — | — | US | claimed |
| US-11926716-B2 | Multifunctional smart particles | SYNMATTER LLC (US) | 2024-03-12 | — | — | US | claimed |
| CN-116836593-A | Anti-icing hydrophobic coating and preparation method and application thereof | 中国科学院过程工程研究所 | 2023-10-03 | — | — | CN | claimed |
| US-20230120425-A1 | Multifunctional Smart Particles | SYNMATTER LLC (US) | 2023-04-20 | — | — | US | claimed |
| CN-114958186-A | Preparation method and application of transparent long-acting easy-to-clean flame-retardant anti-fouling coating of photovoltaic panel | 江苏大学 | 2022-08-30 | — | — | CN | claimed |
| CN-112366425-B | Leakage-proof blue-coated ceramic coating film and preparation method thereof | 江苏厚生新能源科技有限公司 | 2022-06-17 | — | — | CN | claimed |
| US-11322701-B2 | High dielectric constant composite material and application thereof | PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL (CN) | 2022-05-03 | — | — | US | claimed |
| CN-114232050-A | Manufacturing method of high-corrosion-resistance light oil storage container | 中国电子科技集团公司第十四研究所 | 2022-03-25 | — | — | CN | claimed |
| CN-111231196-A | Hydrophobic sealing ring and preparation method and application thereof | 无锡小天鹅电器有限公司 | 2020-06-05 | — | — | CN | claimed |
| CN-111234615-A | Composition for hydrophobic coating, preparation method and application thereof | 无锡小天鹅电器有限公司 | 2020-06-05 | — | — | CN | claimed |
| CN-111205644-A | High-transparency high-heat-resistance polyimide film and preparation method thereof | 无锡创彩光学材料有限公司 | 2020-05-29 | — | — | CN | claimed |
| CN-111205643-A | Transparent polyimide film and preparation method thereof | 无锡创彩光学材料有限公司 | 2020-05-29 | — | — | CN | claimed |
| CN-111081470-A | Polyimide capacitor | 南京中鸿润宁新材料科技有限公司 | 2020-04-28 | — | — | CN | claimed |
| CN-111073019-A | Surface hydrophobic modification method of flexible organic polymer substrate | 北京市理化分析测试中心 | 2020-04-28 | — | — | CN | claimed |
| US-20200106034-A1 | HIGH DIELECTRIC CONSTANT COMPOSITE MATERIAL AND APPLICATION THEREOF | PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL (CN) | 2020-04-02 | — | — | US | claimed |
| CN-110615998-A | Wear-resistant super-hydrophobic coating composition | 上海大学 | 2019-12-27 | — | — | CN | claimed |
| US-7435074-B2 | Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-14 | — | — | US | claimed |
| US-20050202350-A1 | Multilevel mold; used for the interconnect architecture of semiconductor chips | GLOBALFOUNDRIES U.S. INC. | 2005-09-15 | — | — | US | claimed |