SCHEMBL6637639

SCHEMBL6637639

CCCCCCC=C(C)C(=O)OC1CCC2OC2C1

nearest known ligand 0.39

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CCR2 P41597 1/20 0.39
EP300 Q09472 1/20 0.36
TBXA2R P21731 3/20 0.35
NAAA Q02083 2/20 0.35
PRKD3 O94806 2/20 0.34
PRKCG P05129 2/20 0.34
PRKCB P05771 2/20 0.34
PRKCA P17252 2/20 0.34
PRKCH P24723 2/20 0.34
PRKCE Q02156 2/20 0.34
PRKCQ Q04759 2/20 0.34
PRKCD Q05655 2/20 0.34
PRKD1 Q15139 2/20 0.34
FAAH O00519 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28250278 0.95 TBXA2R (0.33) CCR2TBXA2R
SCHEMBL16536409 0.89 TBXA2R (0.36) TBXA2R
SCHEMBL3260089 0.84 PPM1B (0.36)
SCHEMBL3260094 0.84 PPM1B (0.36)
SCHEMBL27651287 0.83 NAAA (0.44) CCR2EP300NAAAFAAH
SCHEMBL27632361 0.78 NAAA (0.56) CCR2EP300NAAA
SCHEMBL20873744 0.78 NAAA (0.56) CCR2EP300NAAA
SCHEMBL28464171 0.78 NAAA (0.53) CCR2EP300NAAA
SCHEMBL421868 0.77 PPM1B (0.33)
SCHEMBL350305 0.77 PPM1B (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1422564-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same Great Eastern Resins Industrial Co., Ltd (TW) 2004-05-26 EP claimed
US-20040097689-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same GREAT EASTERN RESINS INDUSTRIAL CO., LTD., TAIWAN, R.O.C. 2004-05-20 US claimed
EP-1422564-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same Great Eastern Resins Industrial Co., Ltd (TW) 2004-05-26 EP disclosed
US-20040097689-A1 Photosensitive thermosetting resin and solder resist ink composition containing the same GREAT EASTERN RESINS INDUSTRIAL CO., LTD., TAIWAN, R.O.C. 2004-05-20 US disclosed