SCHEMBL6661904

SCHEMBL6661904

CCC(C)OC(=O)OOOC(C)(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30456637 0.86
SCHEMBL5278701 0.84 MAPT (0.34)
SCHEMBL30457672 0.83
SCHEMBL30457297 0.83
SCHEMBL30456742 0.80 LMNA (0.30)
SCHEMBL24277 0.80 TSHR (0.37)
SCHEMBL28831847 0.80 MAPT (0.30)
SCHEMBL35461 0.80 MAPT (0.36)
SCHEMBL82475 0.78
SCHEMBL3968213 0.77 MAPT (0.34)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-62124148-A None JP disclosed
JP-1233269-A None JP disclosed
WO-2025075122-A1 CROSSLINKED RESIN PARTICLES AND THERMOPLASTIC RESIN MODIFIER 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075124-A1 MOLDED FILM OR MOLDED SHEET 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075121-A1 CROSS-LINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075123-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075120-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075116-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075117-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075125-A1 BLOW-MOLDED ARTICLE AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2024090484-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2024-05-02 WO disclosed
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US disclosed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP disclosed
EP-1220837-B1 PROCESS FOR PREPARING PEROXIDES USING MIXED ANHYDRIDES AKZO NOBEL NV (NL) 2004-08-18 EP disclosed
US-20040049070-A1 Reacting a hydroperoxide or acyl hydroperoxide with a mixed anhydride having a -C(O)-O-C(O)-O- group to form a peracid or diacyl peroxide; OVERKAMP JOHANNES WILLIBRORDUS (NL) 2004-03-11 US disclosed
US-6610880-B1 Reacting with an organohydroperoxide under basic conditions to form peracids, peresters, diacylperoxides or their hydroxy derivatives; low cost; odorless; high yield AKZO NOBEL NV (NL) 2003-08-26 US disclosed
EP-1220837-A1 PROCESS FOR PREPARING PEROXIDES USING MIXED ANHYDRIDES Akzo Nobel N.V. (NL) 2002-07-10 EP disclosed
WO-2001027078-A1 PROCESS FOR PREPARING PEROXIDES USING MIXED ANHYDRIDES AKZO NOBEL N.V. (NL) 2001-04-19 WO disclosed
JP-H01233269-A PEROXIDE COMPOSITION KAYAKU NUURII KK 1989-09-19 JP disclosed
JP-S62124148-A CROSSLINKING AGENT FOR SILICONE RUBBER KAYAKU NUURII KK 1987-06-05 JP disclosed