SCHEMBL6661985

SCHEMBL6661985

CC(F)N(F)F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11227180 0.95
SCHEMBL15646030 0.95
SCHEMBL7360647 0.74
SCHEMBL6767753 0.70
SCHEMBL14498529 0.70
Hydrochloric Acid SCHEMBL28931785 0.67
SCHEMBL16144920 0.65
SCHEMBL19049 0.65
SCHEMBL25296 0.65
SCHEMBL25218973 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110246966-A A kind of novel ferroelectric photovoltaic material and its application 东南大学 2019-09-17 CN claimed
CN-110041208-A A kind of three-dimensional molecular base ferroelectric memory device 东南大学 2019-07-23 CN claimed
EP-1055699-B1 Epoxy foam precursor NEO EX LAB INC (JP) 2004-08-11 EP claimed
EP-4606867-A1 CURABLE RESIN COMPOSITION Mizuno Corporation (JP) 2025-08-27 EP disclosed
WO-2024122254-A1 CURABLE RESIN COMPOSITION 美津濃株式会社 2024-06-13 WO disclosed
US-11332852-B2 Carbon-fiber-precursor fiber bundle, carbon fiber bundle, and uses thereof MITSUBISHI CHEMICAL CORPORATION (JP) 2022-05-17 US disclosed
WO-2021106714-A1 FIBER-REINFORCED THERMOPLASTIC RESIN MOLDED ARTICLE 東レ株式会社 2021-06-03 WO disclosed
WO-2021095597-A1 MOLDING MATERIAL AND MOLDED ARTICLE 東レ株式会社 2021-05-20 WO disclosed
EP-2676984-B1 PRODUCTION METHOD FOR OBTAINING FIBER-REINFORCED COMPOSITE MATERIAL, AND EPOXY RESIN COMPOSITION USED THEREIN MITSUBISHI CHEM CORP (JP) 2021-04-28 EP disclosed
WO-2020235486-A1 PREPREG, MULTILAYER BODY AND MOLDED ARTICLE 東レ株式会社 (JP) 2020-11-26 WO disclosed
US-20200263327-A1 CARBON-FIBER-PRECURSOR FIBER BUNDLE, CARBON FIBER BUNDLE, AND USES THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2020-08-20 US disclosed
US-20130295811-A1 CARBON-FIBER-PRECURSOR FIBER BUNDLE, CARBON FIBER BUNDLE, AND USES THEREOF MITSUBISHI RAYON CO., LTD. (JP) 2013-11-07 US disclosed
EP-2628827-A1 CARBON-FIBER-PRECURSOR FIBER BUNDLE, CARBON FIBER BUNDLE, AND USES THEREOF Mitsubishi Rayon Co., Ltd. (JP) 2013-08-21 EP disclosed
EP-1055699-B1 Epoxy foam precursor NEO EX LAB INC (JP) 2004-08-11 EP disclosed
US-6550847-B2 Devices and methods for reinforcing hollow structural members NEO-EX LAB, INC. (JP) 2003-04-22 US disclosed
US-6403668-B1 FOAMS CONTAINING EPOXY RESINS; MIXING, KNEADING, MOLDING NEO-EX LAB, INC. (JP) 2002-06-11 US disclosed
US-6357819-B1 Shaped foamable materials NEO-EX LAB., INC. (JP) 2002-03-19 US disclosed
US-20010042353-A1 Devices and methods for reinforcing hollow structural members NEO-EX LAB, INC. (JP) 2001-11-22 US disclosed
EP-1149679-A2 Devices and structures for reinforcing hollow structural members NEO-EX LAB. INC. (JP) 2001-10-31 EP disclosed
EP-1055699-A1 Epoxy foam precursor NEO-EX LAB. INC. (JP) 2000-11-29 EP disclosed