Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.55 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.55 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.55 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5397124 | 0.92 | ALDH1A1 (0.48) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL11683945 | 0.86 | ALDH1A1 (0.42) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL5387898 | 0.82 | ALDH1A1 (0.58) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL29631091 | 0.82 | TSHR (0.68) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL155434 | 0.82 | TSHR (0.68) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL81645 | 0.81 | ALDH1A1 (0.51) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL32689847 | 0.81 | ALDH1A1 (0.51) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL29361201 | 0.81 | ALDH1A1 (0.51) | TSHRTDP1ALDH1A1HSD17B10 | |
| Benzene SCHEMBL12472151 | 0.80 | TSHR (0.71) | TSHRTDP1ALDH1A1HSD17B10 | |
| SCHEMBL11655234 | 0.80 | TSHR (0.66) | TSHRTDP1ALDH1A1HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0814109-B1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL CO LTD (JP) | 2004-08-18 | — | — | EP | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20020048726-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-04-25 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| US-6319656-B1 | FORMING FILM OF A NEGATIVE-WORKING PHOTO-SENSITIVE POLYIMIDE PRECURSOR ON A SUBSTRATE; EXPOSING FILM TO LIGHT THROUGH A MASK HAVING A PREDETERMINED PATTERN; DEVELOPING THE EXPOSED FILM USING AN ALKALINE AQUEOUS SOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6200831-B1 | HEAT-CURING A COATING OF A POLYAMIC ACID BASED ON A TETRACARBOXYLIC ACID AND A DIAMINE CONTAINNG AN ACTIVE OXYGEN OR NITROGEN FUNCTIONAL GROUP; SEALING THE EXTERNAL TERMINALS WITH A RESIN, E.G. AN EPOXIDE | HITACHI, LTD. (JP) | 2001-03-13 | — | — | US | disclosed |
| US-6087006-A | SEMICONDUCTOR DEVICE HAVING SURFACE-PROTECTING FILM COMPRISING POLYIMIDE OBTAINED BY HEAT-CURING PRECURSOR HAVING POLAR SUBSTITUENTS AS THE SIDE CHAINS | HITACHI, LTD. (JP) | 2000-07-11 | — | — | US | disclosed |
| US-6025113-A | FOR PREPARING HIGHLY SENSITIVE NEGATIVE-WORKING PHOTOSENSITIVE MATERIAL DEVELOPABLE WITH ALKALINE AQUEOUS SOLUTION IN SHORT TIME WITH HIGH RESOLUTION | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-15 | — | — | US | disclosed |
| EP-0814109-A1 | Photosensitive polyimide precursor and its use for pattern formation | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1997-12-29 | — | — | EP | disclosed |