⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL6090781 | 0.98 | — | — | |
| SCHEMBL4738075 | 0.73 | — | — | |
| SCHEMBL2837821 | 0.73 | — | — | |
| SCHEMBL6600200 | 0.73 | GRIN2D (0.30) | — | |
| SCHEMBL13105608 | 0.71 | — | — | |
| SCHEMBL6674261 | 0.71 | — | — | |
| SCHEMBL17893145 | 0.71 | — | — | |
| SCHEMBL144394 | 0.70 | — | — | |
| SCHEMBL2833543 | 0.70 | — | — | |
| SCHEMBL10890702 | 0.68 | LMNA (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103459544-B | Adhesive and adhesive material using same, and usage method therefor | 日立化成株式会社 | 2017-02-15 | — | — | CN | claimed |
| CN-103476894-B | Adhesive, adhesive material using same, and method for using same | 日立化成株式会社 | 2017-02-15 | — | — | CN | claimed |
| CN-103476895-B | Adhesive, adhesive material using same, and method for using same | 日立化成株式会社 | 2017-02-15 | — | — | CN | claimed |
| CN-106605324-B | Negative electrode for secondary battery, method for producing same, and lithium ion secondary battery having same | 三井化学株式会社 | 2019-07-26 | — | — | CN | disclosed |
| CN-109535423-A | Polyimide precursor composition, the manufacturing method of polyimides, polyimides, polyimide film and substrate | 宇部兴产株式会社 | 2019-03-29 | — | — | CN | disclosed |
| CN-108884253-A | Copolymer foam having polyamide blocks and polyether blocks | 阿科玛法国公司 | 2018-11-23 | — | — | CN | disclosed |
| CN-105764991-B | Polyimide precursor composition, method for producing polyimide, polyimide film, and substrate | 宇部兴产株式会社 | 2018-10-26 | — | — | CN | disclosed |
| CN-107925060-A | Composite material paste for negative electrode of lithium ion secondary battery, negative electrode for lithium ion secondary battery, method for producing negative electrode for lithium ion secondary battery, and lithium ion secondary battery | 三井化学株式会社 | 2018-04-17 | — | — | CN | disclosed |
| CN-105764990-B | Polyimide precursor composition, the manufacture method of polyimides, polyimides, polyimide film and substrate | 宇部兴产株式会社 | 2018-03-20 | — | — | CN | disclosed |
| CN-107709462-A | Dimer-containing polyamide resin and resin composition thereof | 日本化药株式会社 | 2018-02-16 | — | — | CN | disclosed |
| CN-106605324-A | Negative electrode for secondary battery, method for producing same, and lithium ion secondary battery having same | 三井化学株式会社 | 2017-04-26 | — | — | CN | disclosed |
| CN-101589122-A | Two-package type, air-drying, vibration-damping coating composition | IHON TOKUSHU TORYO CO LTD (JP) | 2009-11-25 | — | — | CN | disclosed |
| CN-101511895-A | Polymerization catalyst for polythiourethane optical material, polymerizable composition containing the catalyst, polythiourethane resin obtained from the composition, and process for producing the polythiourethane resin | MITSUI CHEMICALS INC (JP) | 2009-08-19 | — | — | CN | disclosed |
| US-20090099143-A1 | TETRAHYDRO-INDAZOLE CANNABINOID MODULATORS | LAGU BHARAT | 2009-04-16 | — | — | US | disclosed |
| CN-101384636-A | Polymerizable composition for polythiourethane optical material | MITSUI CHEMICALS INC (JP) | 2009-03-11 | — | — | CN | disclosed |
| CN-101370841-A | Internal mold release agent for producing polythiourethane optical material | MITSUI CHEMICALS INC (JP) | 2009-02-18 | — | — | CN | disclosed |
| CN-1993399-A | Curable resin composition, molded article, and method for producing same | SHOWA HIGHPOLYMER (JP) | 2007-07-04 | — | — | CN | disclosed |
| EP-1094087-B1 | EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE, AND FIBER-REINFORCED COMPOSITE CONTAINING THE SAME | TORAY INDUSTRIES (JP) | 2004-09-08 | — | — | EP | disclosed |
| US-6410127-B1 | WITH AMINE CURING AGENT | TORAY INDUSTRIES, INC. (JP) | 2002-06-25 | — | — | US | disclosed |
| EP-1094087-A1 | EPOXY RESIN COMPOSITION, EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE, AND FIBER-REINFORCED COMPOSITE CONTAINING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2001-04-25 | — | — | EP | disclosed |