SCHEMBL6669207

SCHEMBL6669207

CCCCCCC(C)(C)CC(CCCCCCC(=O)O)(CC(C)(C)CCCCCC)C(=O)O

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 7/20 0.55
PPARG P37231 7/20 0.55
PPARD Q03181 7/20 0.55
PPARA Q07869 7/20 0.55
HDAC11 Q96DB2 5/20 0.55
TSHR P16473 4/20 0.55
PTPN1 P18031 3/20 0.55
FABP4 P15090 3/20 0.55
ALDH1A1 P00352 2/20 0.55
TLR2 O60603 2/20 0.55
TDP1 Q9NUW8 2/20 0.55
KMT2A Q03164 2/20 0.55
ALOX15 P16050 2/20 0.55
HSD17B10 Q99714 2/20 0.55
SLC22A6 Q4U2R8 1/20 0.55
SLC22A8 Q8TCC7 1/20 0.55
MEN1 O00255 1/20 0.55
ESR1 P03372 1/20 0.55
PDE4A P27815 1/20 0.55
PDE3A Q14432 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11160457 0.91 GPR84 (0.47) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL9955376 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL9956450 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL22079 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL9111221 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL16857922 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL136070 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL9954788 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL9954322 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL9954783 0.86 GPR84 (0.68) GPR84PPARGPPARDPPARAHDAC11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0982392-B1 Thermally conductive grease composition and semiconductor device using the same SHINETSU CHEMICAL CO (JP) 2004-09-22 EP disclosed
US-20020018885-A1 Mixture of aluminum in oil SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-02-14 US disclosed
US-6136758-A SURFACE TREATED WITH ORGANOSILANE; GREASE COMPOSITION USED FOR THE HEAT REDUCTION OF ELECTRONIC DEVICES SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-10-24 US disclosed
EP-0982391-A1 Aluminium nitride powder and thermally conductive grease composition using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-03-01 EP disclosed
EP-0982392-A1 Thermally conductive grease composition and semiconductor device using the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 2000-03-01 EP disclosed
EP-0939115-A1 Thermally conductive grease composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1999-09-01 EP disclosed