SCHEMBL6671564

SCHEMBL6671564

C=C(C)C(=O)NC(O)C(Cl)(Cl)Cl

nearest known ligand 0.42

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TGFBR1 P36897 1/20 0.42
HPGD P15428 1/20 0.42
RXFP1 Q9HBX9 1/20 0.32
ALDH1A1 P00352 2/20 0.31
MEN1 O00255 1/20 0.30
MAPT P10636 1/20 0.30
NFKB1 P19838 1/20 0.30
NFKB2 Q00653 1/20 0.30
KMT2A Q03164 1/20 0.30
RELA Q04206 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11603789 0.80 TGFBR1 (0.46) TGFBR1ALDH1A1
SCHEMBL7757007 0.80 TGFBR1 (0.44) TGFBR1RXFP1ALDH1A1
SCHEMBL25292405 0.77 HPGD (0.47) HPGDALDH1A1MEN1MAPTNFKB1
SCHEMBL24333197 0.74 TGFBR1 (0.50) TGFBR1RXFP1ALDH1A1
SCHEMBL1820299 0.74 TGFBR1 (0.50) TGFBR1RXFP1ALDH1A1
SCHEMBL11342032 0.73 TGFBR1 (0.45) TGFBR1RXFP1ALDH1A1
SCHEMBL8973983 0.73 TGFBR1 (0.45) TGFBR1RXFP1ALDH1A1
SCHEMBL50197 0.72
Ammonia Solution, Strong SCHEMBL717284 0.71 TGFBR1 (0.40) TGFBR1RXFP1
Dicloralurea SCHEMBL134347 0.71 HPGD (0.45) HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2960314-B1 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE FUJIMI INC (JP) 2024-06-26 EP disclosed
US-11897081-B2 Method for polishing silicon substrate and polishing composition set FUJIMI INCORPORATED (JP) 2024-02-13 US disclosed
EP-3159915-B1 METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET FUJIMI INC (JP) 2023-12-06 EP disclosed
EP-3133638-B1 COMPOSITION FOR POLISHING SILICON WAFERS FUJIMI INC (JP) 2021-10-27 EP disclosed
CN-106463386-B Method for polishing silicon wafer, polishing composition, and polishing composition set 福吉米株式会社 2020-12-01 CN disclosed
EP-2957613-B1 POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE FUJIMI INC (JP) 2020-11-18 EP disclosed
US-10745588-B2 Silicon wafer polishing composition FUJIMI INCORPORATED (JP) 2020-08-18 US disclosed
CN-111040731-A Composition for polishing silicon wafer 福吉米株式会社 2020-04-21 CN disclosed
EP-3007213-B1 USE OF A COMPOSITION FOR SILICON WAFER POLISHING FUJIMI INC (JP) 2020-03-18 EP disclosed
EP-3133639-B1 COMPOSITION FOR POLISHING SILICON WAFERS FUJIMI INC (JP) 2019-06-26 EP disclosed
US-20150376464-A1 POLISHING COMPOSITION, METHOD FOR PRODUCING POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHED ARTICLE FUJIMI INCORPORATED (JP) 2015-12-31 US disclosed
EP-2960314-A1 POLISHING COMPOSITION AND METHOD FOR MANUFACTURING POLISHED ARTICLE Fujimi Incorporated (JP) 2015-12-30 EP disclosed
EP-2957613-A1 POLISHING COMPOSITION, PRODUCTION METHOD FOR POLISHING COMPOSITION, AND PRODUCTION METHOD FOR POLISHED ARTICLE Fujimi Incorporated (JP) 2015-12-23 EP disclosed
WO-2004020446-A2 N-(2, 2, 2-TRICHLORO-1-DIALKYLPHOSPHONATOETHYL) (METH)ACRYLAMIDE, PRODUCTION THEREOF, USE THEREOF AS A COMONOMER FOR THE PRODUCTION OF METHACRYL FOAMS, AND SELF-EXTINGUISHING METHACRYL FOAMS PRODUCED THEREWITH Röhm GmbH & Co. KG (DE) 2004-03-11 WO disclosed
EP-1245652-A1 Aqueous ink for inkjet printing Kao Corporation (JP) 2002-10-02 EP disclosed
US-5852074-A Aqueous ink for inkjet printing KAO CORPORATION (JP) 1998-12-22 US disclosed
EP-0791610-A2 Aqueus ink for inkjet printing KAO CORPORATION (JP) 1997-08-27 EP disclosed
EP-0410276-B1 Graft polymer with unsaturated side groups, light-sensitive mixture containing same and recording material made from same HOECHST AG (DE) 1994-05-11 EP disclosed
US-5134053-A GRAFT POLYMER WITH UNSATURATED LATERAL CHAINS, PHOTOSENSITIVE MIXTURE CONTAINING SAID GRAFT POLYMER AND RECORDING MATERIAL PRODUCED THEREFROM HOECHST AKTIENGESELLSCHAFT (DE) 1992-07-28 US disclosed
US-5128386-A Hot melt adhesives BASF AKTIENGESELLSCHAFT (DE) 1992-07-07 US disclosed