SCHEMBL6691422

SCHEMBL6691422

CC1CC2OC2CC1C(=O)OC1(C)CC2OC2CC1C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9305643 0.80 PPP5C (0.33)
SCHEMBL27512937 0.78 SMN1; SMN2 (0.34)
SCHEMBL3791155 0.78
SCHEMBL28761315 0.77 SCN1A (0.35)
SCHEMBL14828626 0.72 PPM1B (0.43)
SCHEMBL2318293 0.72 PPM1B (0.43)
SCHEMBL11275427 0.69 PPM1B (0.39)
SCHEMBL1717660 0.69 PPP5C (0.34)
SCHEMBL2320405 0.68 PPM1B (0.47)
SCHEMBL6441606 0.67 PPP5C (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110741463-B Method for producing substrate with fine concave-convex pattern, resin composition, and laminate 三井化学株式会社 2024-02-20 CN disclosed
CN-113574086-B Photocurable composition, method for producing uneven structure, method for forming fine uneven pattern, and uneven structure 三井化学株式会社 2023-11-07 CN disclosed
CN-116478355-A Benzoxazine resin material for preparing three-dimensional object and using method thereof 清锋(北京)科技有限公司 2023-07-25 CN disclosed
CN-110741463-A Method for producing substrate with fine uneven pattern, resin composition, and laminate 三井化学株式会社 2020-01-31 CN disclosed
US-20040010050-A1 Laminating adhesives hardenable by radiation HUEBENER ACHIM (DE) 2004-01-15 US disclosed