SCHEMBL669765

SCHEMBL669765

CCCC(C)O[Si](C)(C)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7890010 0.84 OPRM1 (0.40)
SCHEMBL3662154 0.82
Ammonia Solution, Strong SCHEMBL28104111 0.80
SCHEMBL29016730 0.79
SCHEMBL11522607 0.79
SCHEMBL29155577 0.77
SCHEMBL26676545 0.77
SCHEMBL26922600 0.76 MCHR1 (0.30)
SCHEMBL27783311 0.76 OPRM1 (0.30)
SCHEMBL27658654 0.76

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101917826-B Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD 2013-08-21 CN claimed
CN-101917826-A Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD 2010-12-15 CN claimed
EP-2596001-B1 WATER-SOLUBLE ORGANOSILICONATE POWDER WACKER CHEMIE AG (DE) 2014-09-03 EP disclosed
CN-101917826-B Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD 2013-08-21 CN disclosed
EP-2596001-A1 WATER-SOLUBLE ORGANOSILICONATE POWDER Wacker Chemie AG (DE) 2013-05-29 EP disclosed
CN-102618164-A Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD 2012-08-01 CN disclosed
WO-2012022544-A1 WATER-SOLUBLE ORGANOSILICONATE POWDER WACKER CHEMIE AG (DE) 2012-02-23 WO disclosed
CN-101917826-A Method for increasing binding force between electric conductor and non-conductive polymer dielectric layer in printed circuit board substrate DONGGUAN RENJI ELECTRONIC MATERIALS CO LTD 2010-12-15 CN disclosed