Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL237624 | 0.80 | — | — | |
| Butane SCHEMBL2243765 | 0.73 | CA5A (0.39) | TDP1 | |
| Propane SCHEMBL28773123 | 0.69 | CA5A (0.42) | TDP1 | |
| Sulfuric Acid SCHEMBL28557703 | 0.69 | TDP1 (0.43) | TDP1 | |
| SCHEMBL1082107 | 0.69 | TP53 (0.38) | — | |
| Hexane SCHEMBL27687701 | 0.67 | TP53 (0.50) | — | |
| SCHEMBL1783443 | 0.67 | — | — | |
| SCHEMBL742169 | 0.67 | — | — | |
| Propane SCHEMBL28027330 | 0.66 | CA5A (0.39) | TDP1 | |
| SCHEMBL10957266 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9777386-B2 | Chemistry additives and process for cobalt film electrodeposition | LAM RESEARCH CORPORATION (US) | 2017-10-03 | — | — | US | claimed |
| US-20160273117-A1 | CHEMISTRY ADDITIVES AND PROCESS FOR COBALT FILM ELECTRODEPOSITION | LAM RESEARCH CORPORATION | 2016-09-22 | — | — | US | claimed |
| WO-2020263837-A1 | ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS | LAM RESEARCH CORPORATION (US) | 2020-12-30 | — | — | WO | disclosed |
| US-9777386-B2 | Chemistry additives and process for cobalt film electrodeposition | LAM RESEARCH CORPORATION (US) | 2017-10-03 | — | — | US | disclosed |
| US-20160273117-A1 | CHEMISTRY ADDITIVES AND PROCESS FOR COBALT FILM ELECTRODEPOSITION | LAM RESEARCH CORPORATION | 2016-09-22 | — | — | US | disclosed |
| US-20040187731-A1 | Acid copper electroplating solutions | WANG QING MIN (US) | 2004-09-30 | — | — | US | disclosed |