Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.48 |
| ▸ | CA2 | P00918 | 3/20 | 0.39 |
| ▸ | CA1 | P00915 | 2/20 | 0.39 |
| ▸ | CA9 | Q16790 | 2/20 | 0.39 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | NT5E | P21589 | 1/20 | 0.32 |
| ▸ | CA4 | P22748 | 1/20 | 0.32 |
| ▸ | CA6 | P23280 | 1/20 | 0.32 |
| ▸ | CA5A | P35218 | 1/20 | 0.32 |
| ▸ | CA7 | P43166 | 1/20 | 0.32 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydroxyamine SCHEMBL27595862 | 0.94 | ALDH1A1 (0.48) | ALDH1A1CA2CA1CA9TSHR | |
| SCHEMBL374821 | 0.94 | — | — | |
| SCHEMBL3883756 | 0.91 | — | — | |
| Iodide SCHEMBL30510675 | 0.91 | — | — | |
| Water SCHEMBL6689986 | 0.91 | — | — | |
| SCHEMBL17456489 | 0.91 | — | — | |
| SCHEMBL17456377 | 0.91 | — | — | |
| Ammonia Solution, Strong SCHEMBL833018 | 0.91 | — | — | |
| SCHEMBL28934634 | 0.91 | — | — | |
| Sulfuric Acid SCHEMBL28899813 | 0.88 | ALDH1A1 (0.48) | ALDH1A1CA2CA1CA9TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122029305-A | Plating film for metal sintering bonding, method for producing the same, and semiconductor mounting substrate | 奥野制药工业株式会社 | 2026-05-12 | — | — | CN | disclosed |
| WO-2025079303-A1 | PLATING FILM FOR METAL SINTERING BONDING, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR MOUNTING SUBSTRATE | 奥野製薬工業株式会社 | 2025-04-17 | — | — | WO | disclosed |
| WO-2022253252-A1 | HETEROCYCLIC COMPOUNDS USEFUL AS HPK1 INHIBITORS | SILEXON BIOTECH CO., LTD. (CN) | 2022-12-08 | — | — | WO | disclosed |
| CN-102149543-B | Deoxygenating laminate | MITSUBISHI GAS CHEMICAL CO | 2014-09-03 | — | — | CN | disclosed |
| CN-102131641-B | Deoxidizing multilayered body | MITSUBISHI GAS CHEMICAL CO | 2013-11-13 | — | — | CN | disclosed |
| CN-102149543-A | Deoxygenating laminate | MITSUBISHI GAS CHEMICAL CO | 2011-08-10 | — | — | CN | disclosed |
| CN-102131641-A | Deoxidizing multilayered body | MITSUBISHI GAS CHEMICAL CO | 2011-07-20 | — | — | CN | disclosed |
| US-20040211291-A1 | Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition | TAMURA KAKEN CORPORATION (JP) | 2004-10-28 | — | — | US | disclosed |
| US-20030047034-A1 | Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition | TAMURA KAKEN CORPORATION (JP) | 2003-03-13 | — | — | US | disclosed |
| EP-1245315-A1 | Method of manufacturing fine metal particles, substance containing fine metal particles and paste solder composition | Tamura Kaken Corporation (JP) | 2002-10-02 | — | — | EP | disclosed |