SCHEMBL672986

SCHEMBL672986

Cc1cc(N)ccc1OCC(C)COc1ccc(N)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.49
GAA P10253 3/20 0.49
TDP1 Q9NUW8 2/20 0.44
TSHR P16473 1/20 0.42
PPARD Q03181 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
PDE10A Q9Y233 1/20 0.38
SCN4A P35499 4/20 0.38
KDM4E B2RXH2 3/20 0.37
MAPT P10636 3/20 0.37
NPSR1 Q6W5P4 1/20 0.37
RXFP1 Q9HBX9 1/20 0.37
MEN1 O00255 1/20 0.35
USP2 O75604 1/20 0.35
TP53 P04637 1/20 0.35
POLB P06746 1/20 0.35
CASP1 P29466 1/20 0.35
HTT P42858 1/20 0.35
CASP7 P55210 1/20 0.35
KMT2A Q03164 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14407437 0.83 TDP1 (0.59) ALDH1A1GAATDP1TSHRSMN1; SMN2
SCHEMBL5866593 0.82 ALDH1A1 (0.71) ALDH1A1GAATDP1TSHRPDE10A
SCHEMBL14088679 0.80 TDP1 (0.47) ALDH1A1GAATDP1TSHRSMN1; SMN2
SCHEMBL11707859 0.79 ALDH1A1 (0.53) ALDH1A1GAAPDE10ASCN4AKDM4E
SCHEMBL11234372 0.76 GAA (0.58) ALDH1A1GAATDP1TSHRSMN1; SMN2
SCHEMBL20496732 0.74 ALDH1A1 (0.53) ALDH1A1GAATSHRSMN1; SMN2PDE10A
SCHEMBL20496733 0.74 ALDH1A1 (0.50) ALDH1A1GAATSHRSMN1; SMN2PDE10A
SCHEMBL11220704 0.73 ALDH1A1 (0.58) ALDH1A1GAATDP1TSHRSCN4A
SCHEMBL10056869 0.72 KDM4E (0.61) ALDH1A1GAATDP1TSHRSMN1; SMN2
SCHEMBL31457276 0.72 ALDH1A1 (0.55) ALDH1A1GAATDP1TSHRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8748325-B2 Method of manufacturing semiconductor device MICRON SEMICONDUCTOR PRODUCTS, INC. 2014-06-10 US disclosed
US-20140038424-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE ELPIDA MEMORY, INC. (JP) 2014-02-06 US disclosed
US-8066891-B2 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film DAI NIPPON PRINTING CO., LTD. (JP) 2011-11-29 US disclosed
US-20070026678-A1 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film DAI NIPPON PRINTING CO., LTD. (JP) 2007-02-01 US disclosed
US-20060073316-A1 HDD suspension and its manufacture NIPPON STEEL CHEMICAL CO., LTD. 2006-04-06 US disclosed
US-20040096676-A1 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film NIPPON STEEL CHEMICAL CO., LTD. (JP) 2004-05-20 US disclosed
US-20020155710-A1 HDD suspension and its manufacture NIPPON STEEL CHEMICAL CO., LTD. (JP) 2002-10-24 US disclosed