SCHEMBL6737765

SCHEMBL6737765

CCc1c(Cc2ccc(N)c(C)c2CC)ccc(N)c1C

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.37
CYP3A4 P08684 2/20 0.37
PIK3CA P42336 1/20 0.37
ALDH1A1 P00352 4/20 0.35
ALOX15 P16050 2/20 0.35
CYP1A2 P05177 1/20 0.35
CASP7 P55210 1/20 0.35
HIF1A Q16665 1/20 0.35
HSD17B10 Q99714 1/20 0.35
NOS3 P29474 1/20 0.35
NOS2 P35228 1/20 0.35
MAPT P10636 2/20 0.34
POLB P06746 1/20 0.34
GAA P10253 1/20 0.31
MAPK1 P28482 1/20 0.31
HTT P42858 1/20 0.31
S100B P04271 1/20 0.31
TP53 P04637 1/20 0.30
THRB P10828 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2772114 0.89 ALDH1A1 (0.43) TSHRCYP3A4PIK3CAALDH1A1ALOX15
Nitrogen SCHEMBL11609883 0.83 ALDH1A1 (0.43) TSHRCYP3A4PIK3CAALDH1A1NOS3
SCHEMBL2049139 0.82 ALDH1A1 (0.33) TSHRALDH1A1ALOX15CYP1A2CASP7
SCHEMBL9847085 0.81 CYP3A4 (0.43) TSHRCYP3A4PIK3CAALDH1A1ALOX15
SCHEMBL22271655 0.77 CYP3A4 (0.30) TSHRCYP3A4PIK3CANOS3NOS2
SCHEMBL39192 0.77 CYP3A4 (0.43) TSHRCYP3A4PIK3CAALDH1A1ALOX15
SCHEMBL3222203 0.76 ALDH1A1 (0.39) TSHRCYP3A4PIK3CAALDH1A1ALOX15
SCHEMBL3675878 0.75
SCHEMBL3673771 0.75 ALDH1A1 (0.33) ALDH1A1ALOX15CYP1A2CASP7HIF1A
SCHEMBL3670397 0.75 SLC6A2 (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12264249-B2 Curable composition for inkjet, cured product and flexible printed circuit board MICROCOSM TECHNOLOGY CO., LTD. (TW) 2025-04-01 US disclosed
US-20250026920-A1 LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL FOR TSV SK Hynix Inc. (KR) 2025-01-23 US disclosed
US-12091767-B2 Laminate and preparing method thereof MICROCOSM TECHNOLOGY CO., LTD. (TW) 2024-09-17 US disclosed
US-20230091093-A1 CURABLE COMPOSITION FOR INKJET, CURED PRODUCT AND FLEXIBLE PRINTED CIRCUIT BOARD MICROCOSM TECHNOLOGY CO., LTD. (TW) 2023-03-23 US disclosed
CN-115668484-A Liquid compression molding material 纳美仕有限公司 2023-01-31 CN disclosed
WO-2022163763-A1 METHOD FOR SEALING ELECTRONIC COMPONENT MOUNTING SUBSTRATE, AND HEAT-CURABLE SHEET ナガセケムテックス株式会社 2022-08-04 WO disclosed
CN-114729215-A Curable composition for inkjet, cured product, and flexible printed wiring board 律胜科技股份有限公司 2022-07-08 CN disclosed
CN-114683633-A Laminate and method for manufacturing same 律胜科技股份有限公司 2022-07-01 CN disclosed
US-20220205123-A1 Laminate and Preparing Method Thereof MICROCOSM TECHNOLOGY CO., LTD. (TW) 2022-06-30 US disclosed
WO-2021261064-A1 LIQUID COMPRESSION MOLDING MATERIAL ナミックス株式会社 2021-12-30 WO disclosed
CN-113056519-A Curable resin composition and curable sheet 长濑化成株式会社 2021-06-29 CN disclosed
WO-2020116467-A1 THERMOSETTING RESIN COMPOSITION AND SHEET ナガセケムテックス株式会社 2020-06-11 WO disclosed
CN-110651007-A Epoxy resin composition, electronic component mounting structure, and method for producing same 长濑化成株式会社 2020-01-03 CN disclosed
US-20120308831-A1 EPOXY RESIN COMPOSITION NAGASE CHEMTEX CORPORATION (JP) 2012-12-06 US disclosed
EP-2508546-A1 EPOXY RESIN COMPOSITION Nagase ChemteX Corporation (JP) 2012-10-10 EP disclosed
US-20040033367-A1 Resin laminate, leather-like sheet, automotive interior material, and process for producing resin laminate IDEMITSU TECHNOFINE CO., LTD. (JP) 2004-02-19 US disclosed
EP-1306208-A1 RESIN LAMINATE, LEATHER-LIKE SHEET, AUTOMOTIVE INTERIOR MATERIAL, AND PROCESS FOR PRODUCING RESIN LAMINATE Idemitsu Technofine Co. Ltd (JP) 2003-05-02 EP disclosed