Acrylic Acid Methyl Ester

Acrylic Acid Methyl Ester

SCHEMBL6744119

C=C(C)C(=O)OC.C=CC(=O)OC.C=CC(=O)OCCCC

nearest known ligand 0.67

Full drug profile on Sugi Atlas →

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 9/20 0.67
HPGD P15428 1/20 0.67
ALDH1A1 P00352 5/20 0.49
CYP3A4 P08684 1/20 0.49
ATM Q13315 1/20 0.47
HCAR2 Q8TDS4 3/20 0.42
MAPT P10636 1/20 0.41
RAB9A P51151 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
TP53 P04637 2/20 0.41
HIF1A Q16665 2/20 0.41
HSD17B10 Q99714 1/20 0.41
THRB P10828 3/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL521825 0.97 TSHR (0.71) TSHRHPGDALDH1A1CYP3A4ATM
SCHEMBL7532090 0.97 TSHR (0.71) TSHRHPGDALDH1A1CYP3A4ATM
SCHEMBL27965774 0.97 TSHR (0.71) TSHRHPGDALDH1A1CYP3A4ATM
SCHEMBL35081 0.97 TSHR (0.71) TSHRHPGDALDH1A1CYP3A4ATM
SCHEMBL10893415 0.97 TSHR (0.71) TSHRHPGDALDH1A1CYP3A4ATM
SCHEMBL5844442 0.97 TSHR (0.71) TSHRHPGDALDH1A1CYP3A4ATM
Acrylic Acid Ethyl Ester SCHEMBL18191074 0.96 TSHR (0.61) TSHRHPGDALDH1A1CYP3A4ATM
SCHEMBL28682532 0.94 TSHR (0.67) TSHRHPGDALDH1A1CYP3A4ATM
Butadiene SCHEMBL3320515 0.94 TSHR (0.67) TSHRHPGDALDH1A1CYP3A4ATM
SCHEMBL7921491 0.94 TSHR (0.67) TSHRHPGDALDH1A1CYP3A4ATM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106749987-A It is a kind of for the SLA photosensitive resin compositions of 3D printing and its application 中山大简高分子材料有限公司 2017-05-31 CN claimed
US-20240124703-A1 RESIN COMPOSITION FOR IMPACT ABSORPTION KOATSU GAS KOGYO CO., LTD. (JP) 2024-04-18 US disclosed
US-20230012924-A1 COMBINATION OF CROSSLINKERS TO IMPROVE COATING PROPERTIES BASF SE (DE) 2023-01-19 US disclosed
CN-104119645-B Composition epoxy resin, prepreg and fibre reinforced composites 东丽株式会社 2016-10-26 CN disclosed
US-20140322554-A1 OPTICAL FILM, POLARIZING PLATE AND LIQUID CRYSTAL DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2014-10-30 US disclosed
CN-101798488-A Heat-sensitive adhesive material RICOH KK 2010-08-11 CN disclosed
CN-100589973-C Heat-sensitive adhesive material RICOH CO LTD 2010-02-17 CN disclosed
CN-1769360-A Heat-sensitive adhesive material RICOH KK (JP) 2006-05-10 CN disclosed
US-6696390-B1 SUBSTRATE LAYERS HAVING OVER/UNDERCOATINGS, INCLUDING POLYESTERS, ACRYLIC, STYRENE-ACRYLIC OR ACETAL RESINS, USED FOR TRANSFERRING IMAGES USING PRINTERS TO RECEIVERS SUCH AS CLOTH, CANVAS, PLASTICS, PAPER, CERAMICS OR METALS RICOH COMPANY, LTD. (JP) 2004-02-24 US disclosed
US-4360582-A POLYMER OF METHYL METHACRYLATE OR VINYL CHLORIDE OR POLYVINYL ALCOHOL ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1982-11-23 US disclosed