SCHEMBL674472

SCHEMBL674472

CCCC[Sn+2]CCCC.O=C([O-])CC(Cc1ccccc1)(OCc1ccccc1)C(=O)[O-]

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CETP P11597 4/20 0.40
ALDH1A1 P00352 2/20 0.36
CYP3A4 P08684 1/20 0.36
TSHR P16473 1/20 0.36
MAPK1 P28482 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
L3MBTL1 Q9Y468 1/20 0.36
CTSK P43235 2/20 0.33
CTSL P07711 1/20 0.32
CTSB P07858 1/20 0.32
MMP1 P03956 1/20 0.32
MMP9 P14780 1/20 0.32
MMP13 P45452 1/20 0.32
PTPN1 P18031 1/20 0.32
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
HDAC3 O15379 2/20 0.32
HDAC4 P56524 1/20 0.31
HDAC1 Q13547 1/20 0.31
HDAC7 Q8WUI4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL674007 0.95 CETP (0.43) CETPALDH1A1CYP3A4TSHRMAPK1
SCHEMBL4446737 0.95 CETP (0.43) CETPALDH1A1CYP3A4TSHRMAPK1
SCHEMBL4454658 0.95 CETP (0.43) CETPALDH1A1CYP3A4TSHRMAPK1
SCHEMBL675408 0.84 PTPN1 (0.35) ALDH1A1MAPK1TDP1L3MBTL1PTPN1
SCHEMBL673999 0.84 ALDH1A1 (0.37) CETPALDH1A1CYP3A4TSHRMAPK1
SCHEMBL673686 0.83 ALDH1A1 (0.36) CETPALDH1A1CYP3A4TSHRPTPN1
SCHEMBL673482 0.82 ATM (0.34) ALDH1A1TSHRTDP1CTSKPTPN1
SCHEMBL675638 0.82 ATM (0.36) ALDH1A1CYP3A4TSHRTDP1PTPN1
SCHEMBL672705 0.82 PTPN1 (0.35) ALDH1A1MAPK1TDP1L3MBTL1PTPN1
SCHEMBL674032 0.72 HDAC3 (0.42) CETPMMP1MMP9MMP13MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240262965-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2024-08-08 US disclosed
WO-2023068083-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-04-27 WO disclosed
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO disclosed
WO-2021256180-A1 URETHANE ADHESIVE COMPOSITION シーカ・ハマタイト株式会社 2021-12-23 WO disclosed
US-20210087438-A1 ADHESIVE COMPOSITION FOR BATTERIES AND ADHESIVE MEMBER FOR BATTERIES USING SAME TOAGOSEI CO., LTD. (JP) 2021-03-25 US disclosed
CN-111989379-A Building with wall structure and method for manufacturing wall structure 思美定株式会社 2020-11-24 CN disclosed
WO-2019203034-A1 BUILDING HAVING WALL STRUCTURE AND METHOD FOR PRODUCING WALL STRUCTURE セメダイン株式会社 2019-10-24 WO disclosed
EP-3178872-B1 MODIFIED SILICONE RESIN FOAMED BODY KANEKA CORP (JP) 2019-06-19 EP disclosed
US-10131722-B2 Method for preparing terminal-modified conjugated diene polymer, terminal-modified conjugated diene polymer, rubber composition and tire BRIDGESTONE CORPORATION (JP) 2018-11-20 US disclosed
US-20170275400-A1 METHOD FOR PREPARING TERMINAL-MODIFIED CONJUGATED DIENE POLYMER, TERMINAL-MODIFIED CONJUGATED DIENE POLYMER, RUBBER COMPOSITION AND TIRE BRIDGESTONE CORPORATION (JP) 2017-09-28 US disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
EP-1619219-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-01-25 EP disclosed
EP-1057861-B1 Use of a crosslinked product as a heat-sensitive elastic adhesive KANEKA CORP (JP) 2004-11-24 EP disclosed
EP-1004628-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2004-02-25 EP disclosed
US-6426392-B1 REACTING/CROSSLINKING ISOBUTYLENE AND DIALKYLTIN DIALKOXIDE; FOR USE AS SEALING; WORKABILITY, MATERIALS HANDLING; RECYCLABILITY; HIGH STRESS RELAXATION AND LOW MEMORY CHARACTERISTICS KANEKA CORPORATION (JP) 2002-07-30 US disclosed
US-6335412-B1 POLYSILOXANE-MODIFIED ISOBUTYLENE POLYMERS AS SEALANTS KANEKA CORPORATION (JP) 2002-01-01 US disclosed
EP-1057861-A2 Thermoplastic crosslinked product and heat-sensitive elastic adhesive KANEKA CORPORATION (JP) 2000-12-06 EP disclosed
EP-1004628-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2000-05-31 EP disclosed