SCHEMBL674557

SCHEMBL674557

CC(C(=O)[O-])C(C)(O)C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.38

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
CA1 P00915 3/20 0.38
CA2 P00918 2/20 0.37
CYP3A4 P08684 1/20 0.31
TSHR P16473 1/20 0.31
NFKB1 P19838 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL674452 0.94 CA2 (0.41) CA1CA2TSHR
Pivalate SCHEMBL6561622 0.78 CA1 (0.39) CA1CA2
SCHEMBL672837 0.77 CA2 (0.30) CA2
L-Lactic Acid SCHEMBL3441408 0.76 CA1 (0.47) CA1CA2CYP3A4TSHRNFKB1
SCHEMBL11170599 0.74 CA1 (0.45) CA1CA2CYP3A4TSHRNFKB1
SCHEMBL672940 0.74
SCHEMBL674619 0.74
SCHEMBL7053452 0.74 CA1 (0.37) CA1CA2
SCHEMBL11857441 0.74 CA1 (0.37) CA1CA2
SCHEMBL5867043 0.73 CA1 (0.38) CA1CA2CYP3A4TSHRNFKB1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240262965-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2024-08-08 US disclosed
CN-111989379-B Building with wall structure and method for manufacturing wall structure 思美定株式会社 2024-02-20 CN disclosed
WO-2023132214-A1 CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2023-07-13 WO disclosed
WO-2023068083-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-04-27 WO disclosed
WO-2023048155-A1 ONE-PACK TYPE CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2023-03-30 WO disclosed
WO-2023013487-A1 MULTICOMPONENT CURABLE COMPOSITION AND UTILIZATION THEREOF 株式会社カネカ 2023-02-09 WO disclosed
WO-2023282048-A1 CURABLE COMPOSITION, CURED PRODUCT, COATING AGENT, AND CONCRETE STRUCTURE 株式会社カネカ 2023-01-12 WO disclosed
CN-115038753-A Composition, curable composition, cured product and storage method 株式会社钟化 2022-09-09 CN disclosed
WO-2021256180-A1 URETHANE ADHESIVE COMPOSITION シーカ・ハマタイト株式会社 2021-12-23 WO disclosed
CN-111989379-A Building with wall structure and method for manufacturing wall structure 思美定株式会社 2020-11-24 CN disclosed
US-20060135709-A1 Curing composition KANEKA CORPORATION (JP) 2006-06-22 US disclosed
EP-1642932-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-04-05 EP disclosed
EP-1637565-A1 CURING COMPOSITION KANEKA CORPORATION (JP) 2006-03-22 EP disclosed
EP-1619219-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2006-01-25 EP disclosed
EP-1057861-B1 Use of a crosslinked product as a heat-sensitive elastic adhesive KANEKA CORP (JP) 2004-11-24 EP disclosed
EP-1004628-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2004-02-25 EP disclosed
US-6426392-B1 REACTING/CROSSLINKING ISOBUTYLENE AND DIALKYLTIN DIALKOXIDE; FOR USE AS SEALING; WORKABILITY, MATERIALS HANDLING; RECYCLABILITY; HIGH STRESS RELAXATION AND LOW MEMORY CHARACTERISTICS KANEKA CORPORATION (JP) 2002-07-30 US disclosed
US-6335412-B1 POLYSILOXANE-MODIFIED ISOBUTYLENE POLYMERS AS SEALANTS KANEKA CORPORATION (JP) 2002-01-01 US disclosed
EP-1057861-A2 Thermoplastic crosslinked product and heat-sensitive elastic adhesive KANEKA CORPORATION (JP) 2000-12-06 EP disclosed
EP-1004628-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2000-05-31 EP disclosed