SCHEMBL6746609

SCHEMBL6746609

O=C(O)c1ccc(OOc2ccc(C(=O)O)cc2)cc1

nearest known ligand 0.67

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.67
TP53 P04637 1/20 0.67
CA1 P00915 3/20 0.65
CA2 P00918 3/20 0.65
PARP15 Q460N3 1/20 0.58
PARP10 Q53GL7 1/20 0.58
KMT2A Q03164 1/20 0.58
SRD5A2 P31213 4/20 0.57
PKM P14618 1/20 0.56
CA12 O43570 1/20 0.55
CA3 P07451 1/20 0.55
TYR P14679 1/20 0.55
DRD1 P21728 1/20 0.55
CA4 P22748 1/20 0.55
CA6 P23280 1/20 0.55
CA5A P35218 1/20 0.55
CA7 P43166 1/20 0.55
CA9 Q16790 1/20 0.55
CA14 Q9ULX7 1/20 0.55
CA5B Q9Y2D0 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28235974 0.85 CA1 (0.56) TSHRTP53CA1CA2PARP15
SCHEMBL14453801 0.85 CA1 (0.56) TSHRTP53CA1CA2PARP15
SCHEMBL12555342 0.85 CA1 (0.68) TSHRTP53CA1CA2PARP15
SCHEMBL28544043 0.84 CA1 (0.54) TSHRTP53CA1CA2PARP15
Terephthalic Acid SCHEMBL9861713 0.83 PARP10 (0.78) TSHRTP53CA1CA2PARP15
SCHEMBL766069 0.83 PARP10 (0.78) TSHRTP53CA1CA2PARP15
SCHEMBL5581520 0.83 PARP10 (0.78) TSHRTP53CA1CA2PARP15
SCHEMBL22281 0.83 PARP10 (0.78) TSHRTP53CA1CA2PARP15
Terephthalic Acid SCHEMBL175823 0.82 TSHR (1.00) TSHRTP53CA1CA2SRD5A2
Terephthalic Acid SCHEMBL5053781 0.82 TSHR (1.00) TSHRTP53CA1CA2SRD5A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117721467-A Copper etching liquid for semiconductor and application of copper etching liquid in rotary spraying process 湖北兴福电子材料股份有限公司 2024-03-19 CN claimed
CN-117721467-A Copper etching liquid for semiconductor and application of copper etching liquid in rotary spraying process 湖北兴福电子材料股份有限公司 2024-03-19 CN disclosed
US-6685997-B1 SOLUTION CONTAINING POLYAMIC ACIDS, POLYAMIDES AND POLYIMIDES; ALIGNMENT FILM; WELL BALANCED ELECTRICAL CHARACTERISTICS; ELIMINATES IMAGE STICKING CHISSO CORPORATION (JP) 2004-02-03 US disclosed