⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6569676 | 0.91 | — | — | |
| SCHEMBL6572974 | 0.89 | — | — | |
| SCHEMBL7054132 | 0.84 | — | — | |
| SCHEMBL20078068 | 0.84 | — | — | |
| SCHEMBL3159288 | 0.78 | — | — | |
| SCHEMBL8432411 | 0.78 | — | — | |
| SCHEMBL5701340 | 0.75 | — | — | |
| SCHEMBL5701314 | 0.75 | — | — | |
| SCHEMBL20078069 | 0.73 | — | — | |
| SCHEMBL5701603 | 0.73 | LMNA (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8217388-B2 | Curable organopolysiloxane composition and semiconductor device | DOW CORNING TORAY COMPANY, LTD. (JP) | 2012-07-10 | — | — | US | disclosed |
| US-8063143-B2 | Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor | DOW CORNING TORAY CO., LTD. (JP) | 2011-11-22 | — | — | US | disclosed |
| US-20110071266-A1 | Curable Organopolysiloxane Composition, Method of Curing Thereof, Semiconductor Device, And Adhesion Promotor | DOW CORNING TORAY CO., LTD. (JP) | 2011-03-24 | — | — | US | disclosed |
| US-20100301377-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | DOW TORAY CO., LTD. (JP) | 2010-12-02 | — | — | US | disclosed |
| US-7842755-B2 | Dimethylvinylsilanol-endcapped polymethylphenylsiloxane, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, platinum catalyst; two-stage thermal curing; high refractive index, light transmittance, adhesion, especially to thermoplastic resins | DOW CORNING TORAY COMPANY, LTD. (JP) | 2010-11-30 | — | — | US | disclosed |
| EP-2061840-B1 | CURABLE ORGNOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO LTD (JP) | 2010-01-06 | — | — | EP | disclosed |
| EP-2061840-A1 | CURABLE ORGNOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | Dow Corning Toray Co., Ltd. (JP) | 2009-05-27 | — | — | EP | disclosed |
| US-20080262158-A1 | Dimethylvinylsilanol-endcapped polymethylphenylsiloxane, an organohydrogenpolysiloxane, a copolymer of a vinyl monomer and a vinyl monomer with hydrosilyl groups, platinum catalyst; two-stage thermal curing; high refractive index, light transmittance, adhesion, especially to thermoplastic resins | DOW CORNING TORAY CO., LTD. (JP) | 2008-10-23 | — | — | US | disclosed |
| EP-1781741-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION, METHOD OF CURING THEREOF, SEMICONDUCTOR DEVICE, AND ADHESION PROMOTER | DOW CORNING TORAY CO LTD (JP) | 2008-08-27 | — | — | EP | disclosed |
| WO-2008023537-A1 | CURABLE ORGNOPOLYSILOXANE COMPOSITION AND SEMICONDUCTOR DEVICE | DOW CORNING TORAY CO., LTD (JP) | 2008-02-28 | — | — | WO | disclosed |
| EP-0967216-B1 | Method for manufacturing siloxane compounds | DOW CORNING TORAY SILICONE (JP) | 2004-04-21 | — | — | EP | disclosed |
| EP-0967216-A1 | Method for manufacturing siloxane compounds | Dow Corning Toray Silicone Company, Ltd. (JP) | 1999-12-29 | — | — | EP | disclosed |
| US-5939507-A | Method for manufacturing siloxane compounds | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1999-08-17 | — | — | US | disclosed |