Formaldehyde

Formaldehyde

SCHEMBL674875

C=O.Oc1ccccc1Br

nearest known ligand 0.47

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.47
CA2 P00918 5/20 0.47
CA4 P22748 4/20 0.47
KDM4E B2RXH2 4/20 0.47
ALOX15 P16050 4/20 0.47
HPGD P15428 4/20 0.47
SMN1; SMN2 Q16637 3/20 0.47
HSD17B10 Q99714 3/20 0.47
HIF1A Q16665 2/20 0.47
CA12 O43570 2/20 0.47
CA14 Q9ULX7 2/20 0.47
MAPT P10636 2/20 0.47
EGFR P00533 2/20 0.47
LMNA P02545 2/20 0.47
FYN P06241 2/20 0.47
MMP9 P14780 2/20 0.47
RECQL P46063 2/20 0.47
TDP1 Q9NUW8 2/20 0.47
NPC1 O15118 1/20 0.47
GMNN O75496 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49313 0.91
SCHEMBL15059320 0.91
SCHEMBL3440828 0.91 ALDH1A1 (0.56) ALDH1A1CA2CA4KDM4EALOX15
SCHEMBL29573828 0.91
SCHEMBL31103367 0.88
Hydrochloric Acid SCHEMBL21820164 0.88
SCHEMBL28504673 0.88
SCHEMBL10560599 0.88
SCHEMBL38651119 0.88
SCHEMBL28509870 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 137 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109476830-B Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article 沙特基础工业全球技术有限公司 2021-07-09 CN claimed
CN-108290386-B Method of forming a cured epoxy material, cured epoxy material formed thereby, and composite core incorporating the cured epoxy material 沙特基础工业全球技术有限公司 2021-05-14 CN claimed
US-20190241698-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2019-08-08 US claimed
EP-3487906-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC Global Technologies B.V. (NL) 2019-05-29 EP claimed
CN-109476830-A Hardener composition and relevant manufacturing process, uncured and cured composition epoxy resin and product 沙特基础工业全球技术有限公司 2019-03-15 CN claimed
US-20180319930-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-11-08 US claimed
EP-3377315-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC Global Technologies B.V. (NL) 2018-09-26 EP claimed
CN-108290386-A It forms the method for cured epoxy material, the cured epoxy material formed by it, useful phenylene ether oligomer-anhydride reaction product and combine the composite material core of cured epoxy material in the method 沙特基础工业全球技术有限公司 2018-07-17 CN claimed
WO-2018022262-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-02-01 WO claimed
EP-1240262-B1 POWDER COATING COMPOSITIONS GEN ELECTRIC (US) 2007-01-31 EP claimed
US-5338781-A Flame retardant epoxy molding compound for encapsulating a semiconductor device DEXTER ELECTRONIC MATERIALS DIVISION OF DEXTER CORP. (US) 1994-08-16 US claimed
EP-0552278-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE. DEXTER ELECTRONIC MATERIALS DI (US) 1993-07-28 EP claimed
EP-0552278-A4 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE. DEXTER ELECTRONIC MATERIALS DI (US) 1993-05-19 EP claimed
US-5154976-A Polyepoxides with phenolic resin hardener, antiomony pentoxide , reactive organobromine compound DEXTER CORPORATION (US) 1992-10-13 US claimed
WO-1992006138-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE DEXTER ELECTRONIC MATERIALS DIVISION OF DEXTER CORPORATION (US) 1992-04-16 WO claimed
US-5104604-A High temperature stability, reliability DEXTER ELECTRONIC MATERIALS DIV. OF DEXTER CORP. (US) 1992-04-14 US claimed
EP-0438524-A4 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENSCAPSULATED DEVICE 1992-04-08 EP claimed
US-5041254-A Brominated phenolic resins DEXTER CORPORATION (US) 1991-08-20 US claimed
EP-0438524-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENSCAPSULATED DEVICE GALLO, Anthony A (US) 1991-07-31 EP claimed
WO-1990004854-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE GALLO ANTHONY A (US) 1990-05-03 WO claimed