Formaldehyde

Formaldehyde

SCHEMBL674875

C=O.Oc1ccccc1Br

nearest known ligand 0.47

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 6/20 0.47
▸ CA2 P00918 5/20 0.47
▸ CA4 P22748 4/20 0.47
▸ KDM4E B2RXH2 4/20 0.47
▸ ALOX15 P16050 4/20 0.47
▸ HPGD P15428 4/20 0.47
▸ SMN1; SMN2 Q16637 3/20 0.47
▸ HSD17B10 Q99714 3/20 0.47
▸ HIF1A Q16665 2/20 0.47
▸ CA12 O43570 2/20 0.47
▸ CA14 Q9ULX7 2/20 0.47
▸ MAPT P10636 2/20 0.47
▸ EGFR P00533 2/20 0.47
▸ LMNA P02545 2/20 0.47
▸ FYN P06241 2/20 0.47
▸ MMP9 P14780 2/20 0.47
▸ RECQL P46063 2/20 0.47
▸ TDP1 Q9NUW8 2/20 0.47
▸ NPC1 O15118 1/20 0.47
▸ GMNN O75496 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49313 0.91 — —
SCHEMBL15059320 0.91 — —
SCHEMBL3440828 0.91 ALDH1A1 (0.56) ALDH1A1CA2CA4KDM4EALOX15
SCHEMBL29573828 0.91 — —
SCHEMBL31103367 0.88 — —
Hydrochloric Acid SCHEMBL21820164 0.88 — —
SCHEMBL38651119 0.88 — —
SCHEMBL10560599 0.88 — —
SCHEMBL28504673 0.88 — —
SCHEMBL28509870 0.88 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 137 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109476830-B Hardener composition and associated forming process, uncured and cured epoxy resin composition, and article 沙特基础工业全球技术有限公司 2021-07-09 — — CN claimed
CN-108290386-B Method of forming a cured epoxy material, cured epoxy material formed thereby, and composite core incorporating the cured epoxy material 沙特基础工业全球技术有限公司 2021-05-14 — — CN claimed
US-20190241698-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SHPP GLOBAL TECHNOLOGIES B.V. (NL) 2019-08-08 — — US claimed
EP-3487906-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC Global Technologies B.V. (NL) 2019-05-29 — — EP claimed
CN-109476830-A Hardener composition and relevant manufacturing process, uncured and cured composition epoxy resin and product 沙特基础工业全球技术有限公司 2019-03-15 — — CN claimed
US-20180319930-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-11-08 — — US claimed
EP-3377315-A1 METHOD OF FORMING A CURED EPOXY MATERIAL, CURED EPOXY MATERIAL FORMED THEREBY, PHENYLENE ETHER OLIGOMER-ANHYDRIDE REACTION PRODUCT USEFUL IN THE METHOD, AND COMPOSITE CORE INCORPORATING THE CURED EPOXY MATERIAL SABIC Global Technologies B.V. (NL) 2018-09-26 — — EP claimed
CN-108290386-A It forms the method for cured epoxy material, the cured epoxy material formed by it, useful phenylene ether oligomer-anhydride reaction product and combine the composite material core of cured epoxy material in the method 沙特基础工业全球技术有限公司 2018-07-17 — — CN claimed
WO-2018022262-A1 HARDENER COMPOSITION AND ASSOCIATED FORMING METHOD, UNCURED AND CURED EPOXY RESIN COMPOSITIONS, AND ARTICLE SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2018-02-01 — — WO claimed
EP-1240262-B1 POWDER COATING COMPOSITIONS GEN ELECTRIC (US) 2007-01-31 — — EP claimed
US-5338781-A Flame retardant epoxy molding compound for encapsulating a semiconductor device DEXTER ELECTRONIC MATERIALS DIVISION OF DEXTER CORP. (US) 1994-08-16 — — US claimed
EP-0552278-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE. DEXTER ELECTRONIC MATERIALS DI (US) 1993-07-28 — — EP claimed
EP-0552278-A4 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE. DEXTER ELECTRONIC MATERIALS DI (US) 1993-05-19 — — EP claimed
US-5154976-A Polyepoxides with phenolic resin hardener, antiomony pentoxide , reactive organobromine compound DEXTER CORPORATION (US) 1992-10-13 — — US claimed
WO-1992006138-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE DEXTER ELECTRONIC MATERIALS DIVISION OF DEXTER CORPORATION (US) 1992-04-16 — — WO claimed
US-5104604-A High temperature stability, reliability DEXTER ELECTRONIC MATERIALS DIV. OF DEXTER CORP. (US) 1992-04-14 — — US claimed
EP-0438524-A4 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENSCAPSULATED DEVICE — 1992-04-08 — — EP claimed
US-5041254-A Brominated phenolic resins DEXTER CORPORATION (US) 1991-08-20 — — US claimed
EP-0438524-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENSCAPSULATED DEVICE GALLO, Anthony A (US) 1991-07-31 — — EP claimed
WO-1990004854-A1 FLAME RETARDANT EPOXY MOLDING COMPOUND, METHOD AND ENCAPSULATED DEVICE GALLO ANTHONY A (US) 1990-05-03 — — WO claimed
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