SCHEMBL6753939

SCHEMBL6753939

CC(C)CCCCc1nc2ccccc2[nH]1

nearest known ligand 0.75

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.75
DDAH1 O94760 1/20 0.56
NPC1 O15118 2/20 0.55
RAB9A P51151 2/20 0.55
PDE10A Q9Y233 1/20 0.52
SMN1; SMN2 Q16637 1/20 0.52
CHRM1 P11229 1/20 0.51
CYP2D6 P10635 1/20 0.51
CYP2C19 P33261 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6756267 0.95 POLB (0.72) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL4117396 0.89 POLB (0.66) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL6586384 0.87 POLB (0.69) POLBDDAH1NPC1RAB9ACHRM1
SCHEMBL6589193 0.87 POLB (0.69) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL7006523 0.87 POLB (1.00) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL7856311 0.85 POLB (0.96) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL30701864 0.85 POLB (0.96) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL7856315 0.85 POLB (0.96) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL30701863 0.85 POLB (0.96) POLBDDAH1NPC1RAB9APDE10A
SCHEMBL7854826 0.85 POLB (0.96) POLBDDAH1NPC1RAB9APDE10A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed