SCHEMBL6753980

SCHEMBL6753980

Cc1cccc2c1nc(CCC(C)C)n2C

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
▸ TLR8 Q9NR97 1/20 0.40
▸ TLR7 Q9NYK1 1/20 0.39
▸ NPY1R P25929 1/20 0.39
▸ CYP1A2 P05177 1/20 0.39
▸ CYP3A4 P08684 1/20 0.39
▸ CYP2D6 P10635 1/20 0.39
▸ CYP2C9 P11712 1/20 0.39
▸ CYP2C19 P33261 1/20 0.39
▸ TSHR P16473 1/20 0.38
▸ MAPK1 P28482 1/20 0.38
▸ NPC1 O15118 3/20 0.37
▸ RAB9A P51151 3/20 0.37
▸ PKM P14618 1/20 0.37
▸ RECQL P46063 1/20 0.36
▸ MAPT P10636 1/20 0.35
▸ HDAC6 Q9UBN7 1/20 0.35
▸ PDE10A Q9Y233 4/20 0.35
▸ GAA P10253 1/20 0.35
▸ SMN1; SMN2 Q16637 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6755245 0.91 TLR8 (0.41) TLR8TLR7NPY1RCYP1A2CYP3A4
SCHEMBL6756151 0.84 PSEN1 (0.43) TLR8NPY1RCYP1A2CYP3A4CYP2D6
SCHEMBL6757250 0.83 TLR8 (0.49) TLR8TLR7CYP1A2CYP3A4CYP2D6
SCHEMBL6756133 0.80 TLR8 (0.54) TLR8TLR7CYP1A2CYP3A4CYP2D6
SCHEMBL9847092 0.79 TLR8 (0.48) TLR8NPY1RCYP1A2CYP3A4CYP2D6
SCHEMBL6756141 0.79 TLR8 (0.56) TLR8TLR7CYP1A2CYP3A4CYP2D6
SCHEMBL6755285 0.78 TLR7 (0.55) TLR8TLR7TSHRRAB9AMAPT
SCHEMBL6753962 0.78 TLR7 (0.55) TLR8TLR7TSHRRAB9AMAPT
SCHEMBL6755313 0.78 TLR7 (0.55) TLR8TLR7TSHRRAB9AMAPT
SCHEMBL6756287 0.78 TLR7 (0.55) TLR8TLR7TSHRRAB9AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 — — US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 — — US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP disclosed
Send feedback