SCHEMBL6756151

SCHEMBL6756151

Cc1cccc2c1nc(CC(C)C)n2C

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PSEN1 P49768 1/20 0.43
▸ PSEN2 P49810 1/20 0.43
▸ APH1B Q8WW43 1/20 0.43
▸ NCSTN Q92542 1/20 0.43
▸ APH1A Q96BI3 1/20 0.43
▸ PSENEN Q9NZ42 1/20 0.43
▸ MEN1 O00255 2/20 0.41
▸ KMT2A Q03164 2/20 0.41
▸ TLR8 Q9NR97 1/20 0.41
▸ LMNA P02545 1/20 0.41
▸ CYP2D6 P10635 2/20 0.40
▸ CYP1A2 P05177 2/20 0.40
▸ CYP3A4 P08684 2/20 0.40
▸ CYP2C9 P11712 2/20 0.40
▸ CYP2C19 P33261 2/20 0.40
▸ RAB9A P51151 5/20 0.40
▸ NPC1 O15118 4/20 0.40
▸ POLB P06746 1/20 0.40
▸ PKM P14618 1/20 0.38
▸ DRD1 P21728 3/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6753980 0.84 TLR8 (0.40) TLR8CYP2D6CYP1A2CYP3A4CYP2C9
SCHEMBL6755245 0.82 TLR8 (0.41) TLR8CYP2D6CYP1A2CYP3A4CYP2C9
SCHEMBL9847092 0.81 TLR8 (0.48) TLR8CYP2D6CYP1A2CYP3A4CYP2C9
SCHEMBL6757250 0.79 TLR8 (0.49) MEN1KMT2ATLR8LMNACYP2D6
SCHEMBL3234243 0.77 TLR8 (0.41) TLR8CYP2D6CYP1A2CYP3A4CYP2C9
SCHEMBL6755341 0.77 TLR8 (0.41) MEN1KMT2ATLR8CYP2D6CYP1A2
SCHEMBL6756133 0.76 TLR8 (0.54) TLR8CYP2D6CYP1A2CYP3A4CYP2C9
SCHEMBL6759188 0.76 MEN1 (0.48) MEN1KMT2ATLR8LMNACYP2D6
SCHEMBL6756141 0.75 TLR8 (0.56) MEN1KMT2ATLR8CYP2D6CYP1A2
SCHEMBL8261363 0.75 CYP2D6 (0.65) MEN1KMT2ALMNACYP2D6RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 — — US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 — — US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 — — EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 — — EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 — — US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 — — EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 — — EP disclosed
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