SCHEMBL6756142

SCHEMBL6756142

CCCCCCCCc1nc2c(C)c(C)ccc2[nH]1

nearest known ligand 0.56

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 5/20 0.42
CBFB Q13951 1/20 0.40
POLB P06746 1/20 0.39
OPRM1 P35372 1/20 0.39
KMT2A Q03164 1/20 0.39
ALDH1A1 P00352 1/20 0.38
PKM P14618 1/20 0.38
HPGD P15428 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6756126 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6753954 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6753963 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6753932 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6753984 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6755314 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6756288 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6755288 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6753879 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A
SCHEMBL6753997 1.00 GPR84 (0.42) GPR84CBFBPOLBOPRM1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP claimed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP claimed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US claimed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP claimed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP claimed
US-6712262-B2 BENZIMIDAZOLE AND IODINE COMPOUNDS TAMURAKAKEN CORPORATION (JP) 2004-03-30 US disclosed
US-20030141351-A1 Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board TAMURA CORPORATION (JP) 2003-07-31 US disclosed
EP-0428260-B1 Metal surface treatment agents SANWA LAB LTD (JP) 2000-01-05 EP disclosed
EP-0562187-B1 Process for production of copper through-hole printed wiring boards SANWA LAB LTD (JP) 1996-01-10 EP disclosed
US-5275694-A Printed circuits with copper through holes, negative patterns, photoresists, lamination, dipping and etching SANWA LABORATORY LTD. (JP) 1994-01-04 US disclosed
EP-0562187-A1 Process for production of copper through-hole printed wiring boards SANWA LABORATORY LTD. (JP) 1993-09-29 EP disclosed
EP-0428260-A2 Metal surface treatment agents SANWA LABORATORY LTD. (JP) 1991-05-22 EP disclosed