SCHEMBL675776

SCHEMBL675776

C=C(C)C(=O)OCCC[Si](OC)(OC)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.46
POLB P06746 1/20 0.46
APEX1 P27695 1/20 0.46
HTT P42858 1/20 0.46
TSHR P16473 4/20 0.43
THRB P10828 1/20 0.37
ELANE P08246 1/20 0.35
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
L3MBTL1 Q9Y468 3/20 0.34
KDM4E B2RXH2 2/20 0.34
MAPK1 P28482 1/20 0.34
NPC1 O15118 2/20 0.33
RAB9A P51151 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
ALDH1A1 P00352 2/20 0.33
LMNA P02545 2/20 0.33
MAPT P10636 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4859315 0.96 TDP1 (0.48) TDP1POLBAPEX1HTTTSHR
SCHEMBL21066820 0.95 TDP1 (0.50) TDP1POLBAPEX1HTTTSHR
SCHEMBL21066727 0.95 TDP1 (0.50) TDP1POLBAPEX1HTTTSHR
SCHEMBL27863616 0.92 POLB (0.42) TDP1POLBAPEX1HTTTSHR
SCHEMBL25755578 0.86 TDP1 (0.44) TDP1POLBAPEX1HTTTSHR
SCHEMBL2345676 0.86 TSHR (0.44) TDP1POLBAPEX1HTTTSHR
SCHEMBL15404813 0.86 TDP1 (0.46) TDP1POLBAPEX1HTTTSHR
SCHEMBL4859732 0.85 TSHR (0.47) TDP1POLBAPEX1HTTTSHR
SCHEMBL4860744 0.85 TDP1 (0.45) TDP1POLBAPEX1HTTTSHR
SCHEMBL9402704 0.84 TSHR (0.49) TDP1POLBAPEX1HTTTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 55 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118954957-A High-strength glass wool and preparation method thereof 清远瀚江玻璃棉科技有限公司 2024-11-15 CN claimed
CN-118725751-A Glass wool adhesive and preparation method thereof 清远瀚江玻璃棉科技有限公司 2024-10-01 CN claimed
EP-2158283-B1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MAT INC (US) 2017-10-18 EP claimed
US-8063140-B2 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2011-11-22 US claimed
EP-2158283-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION Momentive Performance Materials Inc. (US) 2010-03-03 EP claimed
WO-2008156611-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-12-24 WO claimed
US-20080311419-A1 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. 2008-12-18 US claimed
CN-118954957-A High-strength glass wool and preparation method thereof 清远瀚江玻璃棉科技有限公司 2024-11-15 CN disclosed
CN-118725751-A Glass wool adhesive and preparation method thereof 清远瀚江玻璃棉科技有限公司 2024-10-01 CN disclosed
WO-2023136337-A1 DENTAL COMPOSITION, METHOD FOR MANUFACTURING SAME, AND DENTAL SURFACE-TREATED FILLER クラレノリタケデンタル株式会社 2023-07-20 WO disclosed
US-11690237-B2 Field effect-transistor, method for manufacturing same, wireless communication device using same, and product tag TORAY INDUSTRIES, INC. (JP) 2023-06-27 US disclosed
WO-2023106419-A1 DENTAL CURABLE COMPOSITION クラレノリタケデンタル株式会社 2023-06-15 WO disclosed
CN-109716491-B Method for manufacturing field effect transistor and method for manufacturing wireless communication device 东丽株式会社 2023-06-09 CN disclosed
EP-2158283-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION Momentive Performance Materials Inc. (US) 2010-03-03 EP disclosed
WO-2008156611-A1 MOISTURE-CURABLE, GRAFT-MODIFIED RESIN COMPOSITION, PROCESS FOR ITS MANUFACTURE AND PROCESS FOR BONDING SUBSTRATES EMPLOYING THE RESIN COMPOSITION MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2008-12-24 WO disclosed
US-20080311419-A1 Moisture-curable, graft-modified resin composition, process for its manufacture and process for bonding substrates employing the resin composition MOMENTIVE PERFORMANCE MATERIALS INC. 2008-12-18 US disclosed
US-7192986-B2 Inorganic compound sol modified by organic compound CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) 2007-03-20 US disclosed
US-20030193037-A1 INORGANIC COMPOUND SOL MODIFIED BY ORGANIC COMPOUND CATALYSTS & CHEMICALS INDUSTRIES CO., LTD. (JP) 2003-10-16 US disclosed
US-5332779-A Polymerizable silica sol, adamantane derivative for use in the sol and cured resin prepared using the same KAWASAKI STEEL CORPORATION (JP) 1994-07-26 US disclosed
EP-0460560-A2 Polymerizable silica sol, adamantane derivative for use in the sol and cured resin prepared using the same KAWASAKI STEEL CORPORATION (JP) 1991-12-11 EP disclosed